Andreas Ostmann

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Module arrangement comprising an integrated antenna and embedded co...
- Patent number 11,563,266
- Issue date Jan 24, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Ivan Ndip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module arrangement comprising embedded components and an integrated...
- Patent number 11,394,109
- Issue date Jul 19, 2022
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Ivan Ndip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for producing targeted flow and current density p...
- Patent number 9,243,341
- Issue date Jan 26, 2016
- Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Lothar Dietrich
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic assembly including an embedded electronic component
- Patent number 8,975,116
- Issue date Mar 10, 2015
- Technische Universitat Berlin
- Andreas Ostmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for generating an electronic system, method for generating a...
- Patent number 8,861,220
- Issue date Oct 14, 2014
- Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Thomas Löher
- A41 - WEARING APPAREL
Information Patent Grant
Expandable circuit carrier
- Patent number 8,654,536
- Issue date Feb 18, 2014
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Andreas Ostmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrically connecting to a contact of a microelectroni...
- Patent number 8,042,724
- Issue date Oct 25, 2011
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Andreas Ostmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing encapsulated chips
- Patent number 7,011,989
- Issue date Mar 14, 2006
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Karl-Friedrich Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a structured metallization on a semiconductor wafer
- Patent number 6,284,639
- Issue date Sep 4, 2001
- Fraunhofer-Gesellschaft zur Foerderung der angwandten Forschung e.V.
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing chips
- Patent number 6,277,660
- Issue date Aug 21, 2001
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Elke Zakel
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing chips
- Patent number 6,211,571
- Issue date Apr 3, 2001
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung
- Elke Zakel
- G01 - MEASURING TESTING
Information Patent Grant
Method for galvanic forming of bonding pads
- Patent number 5,989,993
- Issue date Nov 23, 1999
- Zakel; Elke
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip support arrangement and chip support for the manufacture of a...
- Patent number 5,956,232
- Issue date Sep 21, 1999
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung e.V.
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULE ARRANGEMENT COMPRISING EMBEDDED COMPONENTS AND AN INTEGRATED...
- Publication number 20180191062
- Publication date Jul 5, 2018
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Ivan NDIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ARRANGEMENT COMPRISING AN INTEGRATED ANTENNA AND EMBEDDED CO...
- Publication number 20180191064
- Publication date Jul 5, 2018
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Ivan NDIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEKTRONISCHES MODUL UND VERFAHREN ZU SEINER HERSTELLUNG
- Publication number 20180040562
- Publication date Feb 8, 2018
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Thomas Löher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PRODUCING TARGETED FLOW AND CURRENT DENSITY P...
- Publication number 20130186852
- Publication date Jul 25, 2013
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Lothar Dietrich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING AN EMBEDDED ELECTRONIC COMPONENT
- Publication number 20130015572
- Publication date Jan 17, 2013
- Technische Universitat Berlin
- Andreas Ostmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR GENERATING AN ELECTRONIC SYSTEM, METHOD FOR GENERATING A...
- Publication number 20120176764
- Publication date Jul 12, 2012
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Thomas Löher
- A41 - WEARING APPAREL
Information Patent Application
Method for the production of expandable circuit carrier and expanda...
- Publication number 20080257589
- Publication date Oct 23, 2008
- Andreas Ostmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Subassembly
- Publication number 20080074856
- Publication date Mar 27, 2008
- FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
- Andreas Ostmann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for electrically connecting to a contact of a microelectroni...
- Publication number 20080061115
- Publication date Mar 13, 2008
- Andreas Ostmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing encapsulated chips
- Publication number 20040110323
- Publication date Jun 10, 2004
- Karl-Friedrich Becker
- H01 - BASIC ELECTRIC ELEMENTS

Andreas Ostmann

Person

Patents Grantslast 30 patents

Module arrangement comprising an integrated antenna and embedded co...

Module arrangement comprising embedded components and an integrated...

Device and method for producing targeted flow and current density p...

Electronic assembly including an embedded electronic component

Method for generating an electronic system, method for generating a...

Expandable circuit carrier

Method for electrically connecting to a contact of a microelectroni...

Method for producing encapsulated chips

Method for forming a structured metallization on a semiconductor wafer

Method and apparatus for testing chips

Method and apparatus for testing chips

Method for galvanic forming of bonding pads

Chip support arrangement and chip support for the manufacture of a...

Patents Applicationslast 30 patents

MODULE ARRANGEMENT COMPRISING EMBEDDED COMPONENTS AND AN INTEGRATED...

MODULE ARRANGEMENT COMPRISING AN INTEGRATED ANTENNA AND EMBEDDED CO...

ELEKTRONISCHES MODUL UND VERFAHREN ZU SEINER HERSTELLUNG

DEVICE AND METHOD FOR PRODUCING TARGETED FLOW AND CURRENT DENSITY P...

ELECTRONIC ASSEMBLY INCLUDING AN EMBEDDED ELECTRONIC COMPONENT

METHOD FOR GENERATING AN ELECTRONIC SYSTEM, METHOD FOR GENERATING A...

Method for the production of expandable circuit carrier and expanda...

Electronic Subassembly

Method for electrically connecting to a contact of a microelectroni...

Method for producing encapsulated chips