Andreas Riegler

Person

Lichtpold, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic circuit with a transistor device and a biasing circuit
- Patent number 12,166,483
- Issue date Dec 10, 2024
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die-package and method
- Patent number 12,014,973
- Issue date Jun 18, 2024
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising side walls connected with c...
- Patent number 11,978,693
- Issue date May 7, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit having a transistor device and a biasing circuit
- Patent number 11,728,790
- Issue date Aug 15, 2023
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a MOSFET
- Patent number 11,545,561
- Issue date Jan 3, 2023
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor oxide or glass based connection body with wiring stru...
- Patent number 11,527,468
- Issue date Dec 13, 2022
- Infineon Technologies AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit with a transistor device and a biasing circuit
- Patent number 11,323,099
- Issue date May 3, 2022
- Infineon Technologies Austria AG
- Hans Weber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Superjunction transistor device with soft switching behavior
- Patent number 11,289,597
- Issue date Mar 29, 2022
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for operating a superjunction transistor device
- Patent number 11,088,275
- Issue date Aug 10, 2021
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die-package and method
- Patent number 11,081,430
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a MOSFET
- Patent number 10,903,341
- Issue date Jan 26, 2021
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor device with gate resistor
- Patent number 10,811,529
- Issue date Oct 20, 2020
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing a semiconductor wafer and semiconductor wafer
- Patent number 10,431,471
- Issue date Oct 1, 2019
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a first through contact structure in oh...
- Patent number 10,411,126
- Issue date Sep 10, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect semiconductor device having N and P-doped pillar regions
- Patent number 10,374,032
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component, method for processing a substrate and meth...
- Patent number 10,361,096
- Issue date Jul 23, 2019
- Infineon Technologies AG
- Mathias Plappert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recombination centers in a semiconductor device
- Patent number 10,347,491
- Issue date Jul 9, 2019
- Infineon Technologies Austria AG
- Wolfgang Jantscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor for a semiconductor device
- Patent number 10,199,291
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor for a semiconductor device
- Patent number 9,793,184
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and insulated gate bipolar transistor with tra...
- Patent number 9,741,835
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRENCH JUNCTION FIELD EFFECT TRANSISTOR HAVING A MESA REGION
- Publication number 20230261117
- Publication date Aug 17, 2023
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20230238333
- Publication date Jul 27, 2023
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICOND...
- Publication number 20230238294
- Publication date Jul 27, 2023
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superjunction Transistor Device
- Publication number 20230126534
- Publication date Apr 27, 2023
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Circuit with a Transistor Device and a Biasing Circuit
- Publication number 20230075897
- Publication date Mar 9, 2023
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A TRENCH STRUCURE
- Publication number 20220310838
- Publication date Sep 29, 2022
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT HAVING A TRANSISTOR DEVICE AND A BIASING CIRCUIT
- Publication number 20220231671
- Publication date Jul 21, 2022
- Hans Weber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC CIRCUIT WITH A TRANSISTOR DEVICE AND A BIASING CIRCUIT
- Publication number 20220077845
- Publication date Mar 10, 2022
- Hans Weber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor Device Package Comprising Side Walls Connected with C...
- Publication number 20220037240
- Publication date Feb 3, 2022
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20220028699
- Publication date Jan 27, 2022
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die-Package and Method
- Publication number 20210335696
- Publication date Oct 28, 2021
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a MOSFET
- Publication number 20210151584
- Publication date May 20, 2021
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superjunction Transistor Device with Soft Switching Behavior
- Publication number 20210057576
- Publication date Feb 25, 2021
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Operating a Superjunction Transistor Device
- Publication number 20200287535
- Publication date Sep 10, 2020
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Oxide or Glass Based Connection Body with Wiring Stru...
- Publication number 20200091058
- Publication date Mar 19, 2020
- INFINEON TECHNOLOGIES AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Device with Gate Resistor
- Publication number 20190319124
- Publication date Oct 17, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die-Package and Method
- Publication number 20190157191
- Publication date May 23, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a MOSFET
- Publication number 20190081158
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field-Effect Semiconductor Device and a Manufacturing Method Therefor
- Publication number 20190051742
- Publication date Feb 14, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field-Effect Semiconductor Device and a Manufacturing Method Therefor
- Publication number 20180294333
- Publication date Oct 11, 2018
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recombination Centers in a Semiconductor Device
- Publication number 20180182629
- Publication date Jun 28, 2018
- Infineon Technologies Austria AG
- Wolfgang Jantscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, METHOD FOR PROCESSING A SUBSTRATE AND METH...
- Publication number 20180053663
- Publication date Feb 22, 2018
- INFINEON TECHNOLOGIES AG
- Mathias Plappert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor for a Semiconductor Device
- Publication number 20170352602
- Publication date Dec 7, 2017
- INFINEON TECHNOLOGIES AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of planarizing a semiconductor wafer and semiconductor wafer
- Publication number 20160315154
- Publication date Oct 27, 2016
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor for a Semiconductor Device
- Publication number 20160268177
- Publication date Sep 15, 2016
- INFINEON TECHNOLOGIES AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Insulated Gate Bipolar Transistor with Tra...
- Publication number 20160141403
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS

Andreas Riegler

Person

Patents Grantslast 30 patents

Electronic circuit with a transistor device and a biasing circuit

Multi-die-package and method

Semiconductor device package comprising side walls connected with c...

Electronic circuit having a transistor device and a biasing circuit

Methods for manufacturing a MOSFET

Semiconductor oxide or glass based connection body with wiring stru...

Electronic circuit with a transistor device and a biasing circuit

Superjunction transistor device with soft switching behavior

Method for operating a superjunction transistor device

Multi-die-package and method

Methods for manufacturing a MOSFET

Transistor device with gate resistor

Method of planarizing a semiconductor wafer and semiconductor wafer

Semiconductor device having a first through contact structure in oh...

Field-effect semiconductor device having N and P-doped pillar regions

Semiconductor component, method for processing a substrate and meth...

Forming recombination centers in a semiconductor device

Sensor for a semiconductor device

Sensor for a semiconductor device

Semiconductor device and insulated gate bipolar transistor with tra...

Patents Applicationslast 30 patents

TRENCH JUNCTION FIELD EFFECT TRANSISTOR HAVING A MESA REGION

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICOND...

Superjunction Transistor Device

Electronic Circuit with a Transistor Device and a Biasing Circuit

SEMICONDUCTOR DEVICE INCLUDING A TRENCH STRUCURE

ELECTRONIC CIRCUIT HAVING A TRANSISTOR DEVICE AND A BIASING CIRCUIT

ELECTRONIC CIRCUIT WITH A TRANSISTOR DEVICE AND A BIASING CIRCUIT

Semiconductor Device Package Comprising Side Walls Connected with C...

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

Multi-Die-Package and Method

Methods for Manufacturing a MOSFET

Superjunction Transistor Device with Soft Switching Behavior

Method for Operating a Superjunction Transistor Device

Semiconductor Oxide or Glass Based Connection Body with Wiring Stru...

Transistor Device with Gate Resistor

Multi-Die-Package and Method

Methods for Manufacturing a MOSFET

Field-Effect Semiconductor Device and a Manufacturing Method Therefor

Field-Effect Semiconductor Device and a Manufacturing Method Therefor

Forming Recombination Centers in a Semiconductor Device

SEMICONDUCTOR COMPONENT, METHOD FOR PROCESSING A SUBSTRATE AND METH...

Sensor for a Semiconductor Device

Method of planarizing a semiconductor wafer and semiconductor wafer

Sensor for a Semiconductor Device

Semiconductor Device and Insulated Gate Bipolar Transistor with Tra...