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Andreas Schlögl
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Ottobrunn, DE
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Patents Grants
last 30 patents
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Patent Grant
Molded semiconductor package with backside die metallization
Patent number
9,099,454
Issue date
Aug 4, 2015
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor component with enhanced avalanche ruggedness
Patent number
6,838,729
Issue date
Jan 4, 2005
Infineon Technologies AG
Andreas Schlögl
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Molded Semiconductor Package with Backside Die Metallization
Publication number
20150041967
Publication date
Feb 12, 2015
INFINEON TECHNOLOGIES AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor component with enhanced avalanche resistance
Publication number
20030155610
Publication date
Aug 21, 2003
Andreas Schlogl
H01 - BASIC ELECTRIC ELEMENTS