Andreas Schmid

Person

Meyriez, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Process kit enclosure system
- Patent number 12,165,905
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Helder Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensors and system for in-situ edge ring erosion monitor
- Patent number 12,009,236
- Issue date Jun 11, 2024
- Applied Materials, Inc.
- Yaoling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ apparatus for semiconductor process module
- Patent number 11,887,879
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process kit ring adaptor
- Patent number 11,842,917
- Issue date Dec 12, 2023
- Applied Materials, Inc.
- Leon Volfovski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable thermal break in a substrate support
- Patent number 11,764,041
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Alvaro Garcia De Gorordo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for determining a position of a ring within a...
- Patent number 11,721,569
- Issue date Aug 8, 2023
- Andrew Myles
- G05 - CONTROLLING REGULATING
Information Patent Grant
Apparatus and method for controlling edge ring variation
- Patent number 11,668,553
- Issue date Jun 6, 2023
- Applied Materials Inc.
- Sathyendra Ghantasala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support carrier with improved bond layer protection
- Patent number 11,651,987
- Issue date May 16, 2023
- Applied Materials, Inc.
- Stephen Donald Prouty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support assembly with arc resistant coolant conduit
- Patent number 11,646,183
- Issue date May 9, 2023
- Applied Materials, Inc.
- Stephen Donald Prouty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing with cooled electrostatic chuck
- Patent number 11,569,114
- Issue date Jan 31, 2023
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic electrostatic chuck
- Patent number 11,437,261
- Issue date Sep 6, 2022
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support carrier with improved bond layer protection
- Patent number 11,380,572
- Issue date Jul 5, 2022
- Applied Materials, Inc.
- Stephen Donald Prouty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic electrostatic chuck
- Patent number 11,373,893
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring removal from processing chamber
- Patent number 11,101,115
- Issue date Aug 24, 2021
- Applied Materials, Inc.
- Nicholas M. Kopec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ apparatus for semiconductor process module
- Patent number 11,075,105
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Movable and removable process kit
- Patent number 11,043,400
- Issue date Jun 22, 2021
- Applied Materials, Inc.
- Andreas Schmid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process kit ring adaptor
- Patent number 10,964,584
- Issue date Mar 30, 2021
- Applied Materials, Inc.
- Leon Volfovski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling element for an electrostatic chuck assembly
- Patent number 10,490,435
- Issue date Nov 26, 2019
- Applied Materials, Inc.
- Michael D. Willwerth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR
- Publication number 20240321610
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Yaoling PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS
- Publication number 20240112894
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Sankaranarayanan RAVI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM CARRIER
- Publication number 20240025670
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Aaron Green
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING EDGE RING VARIATION
- Publication number 20230280150
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Sathyendra GHANTASALA
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR DETERMINING A POSITION OF A RING WITHIN A...
- Publication number 20220406635
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Andrew MYLES
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PROCESSING WITH COOLED ELECTROSTATIC CHUCK
- Publication number 20220262664
- Publication date Aug 18, 2022
- Applied Materials, Inc.
- Yogananda SARODE VISHWANATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT CARRIER WITH IMPROVED BOND LAYER PROTECTION
- Publication number 20220172975
- Publication date Jun 2, 2022
- Applied Materials, Inc.
- Stephen Donald PROUTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING FOR SUBSTRATE EXTREME EDGE PROTECTION
- Publication number 20220157574
- Publication date May 19, 2022
- Applied Materials, Inc.
- Benjamin SCHWARZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR FOR COOLED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20210375599
- Publication date Dec 2, 2021
- Applied Materials, Inc.
- Andrew Antoine NOUJAIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU APPARATUS FOR SEMICONDUCTOR PROCESS MODULE
- Publication number 20210351063
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Yogananda SARODE VISHWANATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED SUBSTRATE SUPPORT ASSEMBLY FOR RADIO FREQUENCY ENVIRONMENTS
- Publication number 20210343512
- Publication date Nov 4, 2021
- Applied Materials, Inc.
- Vijay D. PARKHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT ASSEMBLY WITH ARC RESISTANT COOLANT CONDUIT
- Publication number 20210296101
- Publication date Sep 23, 2021
- Applied Materials, Inc.
- Stephen Donald PROUTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM CARRIER
- Publication number 20210292104
- Publication date Sep 23, 2021
- Applied Materials, Inc.
- Aaron Green
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING EDGE RING VARIATION
- Publication number 20210254957
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Sathyendra GHANTASALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS KIT RING ADAPTOR
- Publication number 20210217650
- Publication date Jul 15, 2021
- Applied Materials, Inc.
- Leon Volfovski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOGENIC ELECTROSTATIC CHUCK
- Publication number 20210082730
- Publication date Mar 18, 2021
- Applied Materials, Inc.
- Yogananda SARODE VISHWANATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE THERMAL BREAK IN A SUBSTRATE SUPPORT
- Publication number 20200395197
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Alvaro GARCIA DE GORORDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS KIT RING ADAPTOR
- Publication number 20200373194
- Publication date Nov 26, 2020
- Applied Materials, Inc.
- Leon Volfovski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT CARRIER WITH IMPROVED BOND LAYER PROTECTION
- Publication number 20200373184
- Publication date Nov 26, 2020
- Applied Materials, Inc.
- Stephen Donald PROUTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS KIT ENCLOSURE SYSTEM
- Publication number 20200373190
- Publication date Nov 26, 2020
- Applied Materials, Inc.
- Helder Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING REMOVAL FROM PROCESSING CHAMBER
- Publication number 20200335312
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Nicholas M. KOPEC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR
- Publication number 20200335368
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Yaoling PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOVABLE AND REMOVABLE PROCESS KIT
- Publication number 20200234981
- Publication date Jul 23, 2020
- Applied Materials, Inc.
- Andreas SCHMID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOGENIC ELECTROSTATIC CHUCK
- Publication number 20200185248
- Publication date Jun 11, 2020
- Applied Materials, Inc.
- Yogananda SARODE VISHWANATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ELEMENT FOR AN ELECTROSTATIC CHUCK ASSEMBLY
- Publication number 20190244848
- Publication date Aug 8, 2019
- Applied Materials, Inc.
- Michael D. Willwerth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU APPARATUS FOR SEMICONDUCTOR PROCESS MODULE
- Publication number 20190088531
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Yogananda SARODE VISHWANATH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER SAWING SYSTEM
- Publication number 20140083407
- Publication date Mar 27, 2014
- Andreas Schmid
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Andreas Schmid

Person

Patents Grantslast 30 patents

Process kit enclosure system

Sensors and system for in-situ edge ring erosion monitor

In-situ apparatus for semiconductor process module

Process kit ring adaptor

Adjustable thermal break in a substrate support

Method and apparatus for determining a position of a ring within a...

Apparatus and method for controlling edge ring variation

Substrate support carrier with improved bond layer protection

Substrate support assembly with arc resistant coolant conduit

Semiconductor processing with cooled electrostatic chuck

Cryogenic electrostatic chuck

Substrate support carrier with improved bond layer protection

Cryogenic electrostatic chuck

Ring removal from processing chamber

In-situ apparatus for semiconductor process module

Movable and removable process kit

Process kit ring adaptor

Cooling element for an electrostatic chuck assembly

Patents Applicationslast 30 patents

SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR

FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS

SUBSTRATE PROCESSING SYSTEM CARRIER

APPARATUS AND METHOD FOR CONTROLLING EDGE RING VARIATION

METHOD AND APPARATUS FOR DETERMINING A POSITION OF A RING WITHIN A...

SEMICONDUCTOR PROCESSING WITH COOLED ELECTROSTATIC CHUCK

SUBSTRATE SUPPORT CARRIER WITH IMPROVED BOND LAYER PROTECTION

RING FOR SUBSTRATE EXTREME EDGE PROTECTION

ELECTRICAL CONNECTOR FOR COOLED SUBSTRATE SUPPORT ASSEMBLY

IN-SITU APPARATUS FOR SEMICONDUCTOR PROCESS MODULE

COOLED SUBSTRATE SUPPORT ASSEMBLY FOR RADIO FREQUENCY ENVIRONMENTS

SUBSTRATE SUPPORT ASSEMBLY WITH ARC RESISTANT COOLANT CONDUIT

SUBSTRATE PROCESSING SYSTEM CARRIER

APPARATUS AND METHOD FOR CONTROLLING EDGE RING VARIATION

PROCESS KIT RING ADAPTOR

CRYOGENIC ELECTROSTATIC CHUCK

ADJUSTABLE THERMAL BREAK IN A SUBSTRATE SUPPORT

PROCESS KIT RING ADAPTOR

SUBSTRATE SUPPORT CARRIER WITH IMPROVED BOND LAYER PROTECTION

PROCESS KIT ENCLOSURE SYSTEM

RING REMOVAL FROM PROCESSING CHAMBER

SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR

MOVABLE AND REMOVABLE PROCESS KIT

CRYOGENIC ELECTROSTATIC CHUCK

COOLING ELEMENT FOR AN ELECTROSTATIC CHUCK ASSEMBLY

IN-SITU APPARATUS FOR SEMICONDUCTOR PROCESS MODULE

WAFER SAWING SYSTEM