Andreas WATERLOO

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Mold compounds and packages for encapsulating electronic components
- Patent number 12,152,133
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Andreas Waterloo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240266311
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECT...
- Publication number 20220310435
- Publication date Sep 29, 2022
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUNDS AND PACKAGES FOR ENCAPSULATING ELECTRONIC COMPONENTS
- Publication number 20220127463
- Publication date Apr 28, 2022
- INFINEON TECHNOLOGIES AG
- Andreas WATERLOO
- H01 - BASIC ELECTRIC ELEMENTS