Andrej Ivankovic

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Rijeka, HR

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Patents Applicationslast 30 patents

Information Patent Application
Method for Forming Isolation Trenches in Micro-Bump Interconnect St...
- Publication number 20130154112
- Publication date Jun 20, 2013
- Katholieke Universiteit Leuven, K.U.Leuven R&D
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS