ANDREJ KOLBASOW

Person

Karstadt OT Nebelin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for removing and repositioning electronic components connect...
- Patent number 12,171,066
- Issue date Dec 17, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing electronic components connected to a circuit board
- Patent number 12,023,756
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip stack arrangement and semiconductor chip for pro...
- Patent number 11,367,709
- Issue date Jun 21, 2022
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Head and Bonding Apparatus
- Publication number 20240359272
- Publication date Oct 31, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-Assisted Soldering Apparatus
- Publication number 20240109144
- Publication date Apr 4, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Monitoring A Laser Soldering Process, And Laser Solderin...
- Publication number 20230219163
- Publication date Jul 13, 2023
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Press-Forming Device for Depositing Solder and Producing Individual...
- Publication number 20230105729
- Publication date Apr 6, 2023
- Pac Tech - Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Removing Electronic Components Connected to a Circuit Board
- Publication number 20220126398
- Publication date Apr 28, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Removing and Repositioning Electronic Components Connect...
- Publication number 20220132714
- Publication date Apr 28, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRO...
- Publication number 20210193619
- Publication date Jun 24, 2021
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...
- Publication number 20200161273
- Publication date May 21, 2020
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- ANDREJ KOLBASOW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

ANDREJ KOLBASOW

Person

Patents Grantslast 30 patents

Method for removing and repositioning electronic components connect...

Method for soldering an electronic component to a circuit board by...

Method for removing electronic components connected to a circuit board

Semiconductor chip stack arrangement and semiconductor chip for pro...

Method and device for establishing a wire connection as well as a c...

Patents Applicationslast 30 patents

Method for Soldering an Electronic Component to a Circuit Board by...

Bonding Head and Bonding Apparatus

Laser-Assisted Soldering Apparatus

Method For Monitoring A Laser Soldering Process, And Laser Solderin...

Press-Forming Device for Depositing Solder and Producing Individual...

Method for Soldering an Electronic Component to a Circuit Board by...

Method for Removing Electronic Components Connected to a Circuit Board

Method for Removing and Repositioning Electronic Components Connect...

SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRO...

METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...