Andres Ramirez Macias

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Zapopan, MX

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Patents Grantslast 30 patents

Information Patent Grant
Flexible and modular top and bottom side processor unit module cooling
- Patent number 12,055,986
- Issue date Aug 6, 2024
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS
- Publication number 20240355702
- Publication date Oct 24, 2024
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
- Publication number 20240345639
- Publication date Oct 17, 2024
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNOLOGIES FOR SEALED LIQUID COOLING SYSTEM
- Publication number 20210321526
- Publication date Oct 14, 2021
- Devdatta Prakash Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
- Publication number 20210208647
- Publication date Jul 8, 2021
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING