Andres Ramirez Macias

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Zapopan, MX

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Patents Grantslast 30 patents

Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS
- Publication number 20240349457
- Publication date Oct 17, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230027076
- Publication date Jan 26, 2023
- Intel Corporation
- Andres Ramirez Macias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING SYSTEM WITH PHORETIC FORCE PARTICULATE COLLECTION
- Publication number 20220117114
- Publication date Apr 14, 2022
- Intel Corporation
- Oscar FARIAS MOGUEL
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
BOILING ENHANCEMENT STRUCTURES FOR IMMERSION COOLED ELECTRONIC SYSTEMS
- Publication number 20210327787
- Publication date Oct 21, 2021
- Intel Corporation
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES
- Publication number 20200251403
- Publication date Aug 6, 2020
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS