Andrew A. Shapiro

Person

Orange, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low temperature co-fired ceramic UHF/VHF power converters
- Patent number 5,661,647
- Issue date Aug 26, 1997
- Hughes Electronics
- Robert D. Washburn
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Low temperature co-fired ceramic substrates for power converters
- Patent number 5,604,673
- Issue date Feb 18, 1997
- Hughes Electronics
- Robert D. Washburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature-cofired-ceramic (LTCC) tape structures including co...
- Patent number 5,532,667
- Issue date Jul 2, 1996
- Hughes Aircraft Company
- Carol Haertling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferrimagnetic vias within multi-layer 3-dimensional structures/subs...
- Patent number 5,438,167
- Issue date Aug 1, 1995
- Hughes Aircraft Company
- Robert F. McClanahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature-cofired-ceramic (LTCC) tape structures including co...
- Patent number 5,312,674
- Issue date May 17, 1994
- Hughes Aircraft Company
- Carol Haertling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via resistors within-multi-layer, 3 dimensional structures substrates
- Patent number 5,164,699
- Issue date Nov 17, 1992
- Hughes Aircraft Company
- Hal D. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via capacitors within multi-layer, 3 dimensional structures/substrates
- Patent number 5,055,966
- Issue date Oct 8, 1991
- Hughes Aircraft Company
- Hal D. Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Andrew A. Shapiro

Person

Patents Grantslast 30 patents

Low temperature co-fired ceramic UHF/VHF power converters

Low temperature co-fired ceramic substrates for power converters

Low-temperature-cofired-ceramic (LTCC) tape structures including co...

Ferrimagnetic vias within multi-layer 3-dimensional structures/subs...

Low-temperature-cofired-ceramic (LTCC) tape structures including co...

Via resistors within-multi-layer, 3 dimensional structures substrates

Via capacitors within multi-layer, 3 dimensional structures/substrates