Andrew Bonthron

Person

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for RF built-in test system for a beamforming...
- Patent number 12,111,350
- Issue date Oct 8, 2024
- Andrew John Bonthron
- G01 - MEASURING TESTING
Information Patent Grant
On-chip high capacitance termination for transmitters
- Patent number 11,307,440
- Issue date Apr 19, 2022
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level output driver with adjustable pre-distortion capability
- Patent number 11,223,348
- Issue date Jan 11, 2022
- Skorpios Technologies, Inc.
- Andrew Bonthron
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
On-chip high capacitance termination for transmitters
- Patent number 10,678,073
- Issue date Jun 9, 2020
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level output driver with adjustable pre-distortion capability
- Patent number 10,587,255
- Issue date Mar 10, 2020
- Skorpios Technologies, Inc.
- Andrew Bonthron
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,703,540
- Issue date Apr 22, 2014
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and circuits for common mode stability and bandwidth broade...
- Patent number 8,593,221
- Issue date Nov 26, 2013
- Semtech Corporation
- Liping Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,367,469
- Issue date Feb 5, 2013
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact high-speed modulator driver method and apparatus
- Patent number 8,150,270
- Issue date Apr 3, 2012
- Kitel Technologies LLC
- Andrew John Bonthron
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip assembly with chip-scale packaging
- Patent number 8,093,714
- Issue date Jan 10, 2012
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting amplifier modulator driver
- Patent number 6,738,173
- Issue date May 18, 2004
- Andrew Bonthron
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
BEAMFORMER RFIC CALIBRATION METHOD THEREFOR
- Publication number 20230275347
- Publication date Aug 31, 2023
- Metawave Corporation
- Rodrigo Manuel LEBRON GARCIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR RF BUILT-IN TEST SYSTEM
- Publication number 20220365133
- Publication date Nov 17, 2022
- Metawave Corporation
- Andrew John BONTHRON
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LEVEL OUTPUT DRIVER WITH ADJUSTABLE PRE-DISTORTION CAPABILITY
- Publication number 20210384897
- Publication date Dec 9, 2021
- Skorpios Technologies, Inc.
- Andrew Bonthron
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ON-CHIP HIGH CAPACITANCE TERMINATION FOR TRANSMITTERS
- Publication number 20200371383
- Publication date Nov 26, 2020
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTI-LEVEL OUTPUT DRIVER WITH ADJUSTABLE PRE-DISTORTION CAPABILITY
- Publication number 20200343883
- Publication date Oct 29, 2020
- Skorpios Technologies, Inc.
- Andrew Bonthron
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ON-CHIP HIGH CAPACITANCE TERMINATION FOR TRANSMITTERS
- Publication number 20180067343
- Publication date Mar 8, 2018
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- G02 - OPTICS
Information Patent Application
MULTI-LEVEL OUTPUT DRIVER WITH ADJUSTABLE PRE-DISTORTION CAPABILITY
- Publication number 20180069542
- Publication date Mar 8, 2018
- Skorpios Technologies, Inc.
- Andrew Bonthron
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20130130441
- Publication date May 23, 2013
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20120115279
- Publication date May 10, 2012
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING
- Publication number 20110140260
- Publication date Jun 16, 2011
- Sierra Monolithics, Inc.
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modulator driver with multi-channel active alignment
- Publication number 20090245813
- Publication date Oct 1, 2009
- Kitel Technologies LLC
- Andrew John Bonthron
- G02 - OPTICS
Information Patent Application
Compact high-speed modulator driver method and apparatus
- Publication number 20090243717
- Publication date Oct 1, 2009
- Kitel Technologies LLC
- Andrew John Bonthron
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
High-speed modulator driver circuit with enhanced drive capability
- Publication number 20090243718
- Publication date Oct 1, 2009
- Kitel Technologies LLC
- Andrew John Bonthron
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method and apparatus for microwave and millimeter-wave imaging
- Publication number 20080100510
- Publication date May 1, 2008
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR HYPERVIEW AUTOMOTIVE RADAR
- Publication number 20080088499
- Publication date Apr 17, 2008
- Andrew J. Bonthron
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for automotive radar sensors
- Publication number 20060262007
- Publication date Nov 23, 2006
- Clariant Technologies, Corp.
- Andrew J. Bonthron
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for automotive radar sensor
- Publication number 20050225481
- Publication date Oct 13, 2005
- Andrew J. Bonthron
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for automotive radar sensors
- Publication number 20050156780
- Publication date Jul 21, 2005
- GHz TR Corporation
- Andrew J. Bonthron
- G01 - MEASURING TESTING
Information Patent Application
Limiting amplifier modulator driver
- Publication number 20030147428
- Publication date Aug 7, 2003
- Andrew Bonthron
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical synchronous coding system
- Publication number 20030063698
- Publication date Apr 3, 2003
- Andrew Bonthron
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Clock and data recovery unit based on class B amplifier
- Publication number 20020163984
- Publication date Nov 7, 2002
- Vladimir V. Katzman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Andrew Bonthron

Person

Patents Grantslast 30 patents

Method and apparatus for RF built-in test system for a beamforming...

On-chip high capacitance termination for transmitters

Multi-level output driver with adjustable pre-distortion capability

On-chip high capacitance termination for transmitters

Multi-level output driver with adjustable pre-distortion capability

Chip-scale semiconductor die packaging method

Methods and circuits for common mode stability and bandwidth broade...

Chip-scale semiconductor die packaging method

Compact high-speed modulator driver method and apparatus

Chip assembly with chip-scale packaging

Limiting amplifier modulator driver

Patents Applicationslast 30 patents

BEAMFORMER RFIC CALIBRATION METHOD THEREFOR

METHOD AND APPARATUS FOR RF BUILT-IN TEST SYSTEM

MULTI-LEVEL OUTPUT DRIVER WITH ADJUSTABLE PRE-DISTORTION CAPABILITY

ON-CHIP HIGH CAPACITANCE TERMINATION FOR TRANSMITTERS

MULTI-LEVEL OUTPUT DRIVER WITH ADJUSTABLE PRE-DISTORTION CAPABILITY

ON-CHIP HIGH CAPACITANCE TERMINATION FOR TRANSMITTERS

MULTI-LEVEL OUTPUT DRIVER WITH ADJUSTABLE PRE-DISTORTION CAPABILITY

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING

Modulator driver with multi-channel active alignment

Compact high-speed modulator driver method and apparatus

High-speed modulator driver circuit with enhanced drive capability

Method and apparatus for microwave and millimeter-wave imaging

METHODS AND APPARATUS FOR HYPERVIEW AUTOMOTIVE RADAR

Methods and apparatus for automotive radar sensors

Method and apparatus for automotive radar sensor

Methods and apparatus for automotive radar sensors

Limiting amplifier modulator driver

Optical synchronous coding system

Clock and data recovery unit based on class B amplifier