Andrew Cahill

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Goleta, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Stress compensation and relief in bonded wafers
- Patent number 10,847,419
- Issue date Nov 24, 2020
- Raytheon Company
- Scott S. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking to form a multi-wafer-bonded structure
- Patent number 10,475,664
- Issue date Nov 12, 2019
- Raytheon Company
- Andrew Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancing die flatness
- Patent number 10,300,649
- Issue date May 28, 2019
- Raytheon Company
- Andrew Cahill
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
STRESS COMPENSATION AND RELIEF IN BONDED WAFERS
- Publication number 20190287854
- Publication date Sep 19, 2019
- Raytheon Company
- Scott S. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCING DIE FLATNESS
- Publication number 20190061221
- Publication date Feb 28, 2019
- Raytheon Company
- Andrew Cahill
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
- Publication number 20180096833
- Publication date Apr 5, 2018
- Raytheon Company
- Andrew Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
- Publication number 20180068843
- Publication date Mar 8, 2018
- Raytheon Company
- Andrew Cahill
- H01 - BASIC ELECTRIC ELEMENTS