Andrew Camien

Person

Costa Mesa, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable semiconductor chip layer comprising prefabricated trench...
- Patent number 7,786,562
- Issue date Aug 31, 2010
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing multilayer modules
- Patent number 7,127,807
- Issue date Oct 31, 2006
- Irvine Sensors Corporation
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer modules with flexible substrates
- Patent number 6,734,370
- Issue date May 11, 2004
- Irvine Sensors Corporation
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking of multilayer modules
- Patent number 6,717,061
- Issue date Apr 6, 2004
- Irvine Sensors Corporation
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack of multilayer modules with heat-focusing metal layer
- Patent number 6,560,109
- Issue date May 6, 2003
- Irvine Sensors Corporation
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable layers containing encapsulated chips
- Patent number 6,117,704
- Issue date Sep 12, 2000
- Irvine Sensors Corporation
- James S. Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of equal layer neo-chips containing encapsulated IC chips of...
- Patent number 6,072,234
- Issue date Jun 6, 2000
- Irvine Sensors Corporation
- Andrew N Camien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable layers containing encapsulated IC chips
- Patent number 5,953,588
- Issue date Sep 14, 1999
- Irvine Sensors Corporation
- Andrew N Camien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH...
- Publication number 20100291735
- Publication date Nov 18, 2010
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable semiconductor chip layer comprising prefabricated trench...
- Publication number 20050277288
- Publication date Dec 15, 2005
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked microelectronic module with vertical interconnect vias
- Publication number 20040113222
- Publication date Jun 17, 2004
- Volkan H. Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer modules with flexible substrates
- Publication number 20040040743
- Publication date Mar 4, 2004
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer modules with flexible substrates
- Publication number 20030047353
- Publication date Mar 13, 2003
- James Satsuo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER
- Publication number 20030048609
- Publication date Mar 13, 2003
- James Satsuo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer modules
- Publication number 20030049889
- Publication date Mar 13, 2003
- James Satsuo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking of multilayer modules
- Publication number 20030049424
- Publication date Mar 13, 2003
- James Satsuo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Andrew Camien

Person

Patents Grantslast 30 patents

Stackable semiconductor chip layer comprising prefabricated trench...

Process of manufacturing multilayer modules

Multilayer modules with flexible substrates

Stacking of multilayer modules

Stack of multilayer modules with heat-focusing metal layer

Stackable layers containing encapsulated chips

Stack of equal layer neo-chips containing encapsulated IC chips of...

Stackable layers containing encapsulated IC chips

Patents Applicationslast 30 patents

STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH...

Stackable semiconductor chip layer comprising prefabricated trench...

Stacked microelectronic module with vertical interconnect vias

Multilayer modules with flexible substrates

Multilayer modules with flexible substrates

STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER

Method of manufacturing multilayer modules

Stacking of multilayer modules