Andrew Hmiel

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Glenside, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
System, apparatus and method for monitoring, detecting and/or sensi...
- Patent number 11,293,801
- Issue date Apr 5, 2022
- SOLAR LIGHT COMPANY, LLC
- Michael H. Bonitatibus
- G01 - MEASURING TESTING
Information Patent Grant
Probe tip plating
- Patent number 7,638,028
- Issue date Dec 29, 2009
- SV Probe Pte. Ltd.
- Bahadir Tunaboylu
- G01 - MEASURING TESTING
Information Patent Grant
System for reducing or eliminating semiconductor device wire sweep
- Patent number 7,109,586
- Issue date Sep 19, 2006
- Kulicke and Soffa Industries, Inc.
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for reducing or eliminating semiconductor device...
- Patent number 6,955,949
- Issue date Oct 18, 2005
- Kulicke & Soffa Investments, Inc.
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for preventing and alleviating short circuiting i...
- Patent number 6,847,122
- Issue date Jan 25, 2005
- Kulicke & Soffa Investments, Inc.
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebonded semiconductor package structure and method of manufacture
- Patent number 6,608,390
- Issue date Aug 19, 2003
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM, APPARATUS AND METHOD FOR MONITORING, DETECTING AND/OR SENSI...
- Publication number 20200132543
- Publication date Apr 30, 2020
- SOLAR LIGHT COMPANY, INC
- Michael H. Bonitatibus
- G01 - MEASURING TESTING
Information Patent Application
Probe tip plating
- Publication number 20060027747
- Publication date Feb 9, 2006
- K&S Interconnect, Inc.
- Bahadir Tunaboylu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reinforced probes for testing semiconductor devices
- Publication number 20060028220
- Publication date Feb 9, 2006
- K&S Interconnect, Inc.
- Edward L. Malantonio
- G01 - MEASURING TESTING
Information Patent Application
System for reducing or eliminating semiconductor device wire sweep
- Publication number 20050224930
- Publication date Oct 13, 2005
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for reducing or eliminating semiconductor device...
- Publication number 20050085019
- Publication date Apr 21, 2005
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebonded semiconductor package structure and method of manufacture
- Publication number 20030090001
- Publication date May 15, 2003
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- H01 - BASIC ELECTRIC ELEMENTS