Andrew J. Cobley

Person

Coventry, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Method of electrolessly depositing metal on the walls of through-holes
- Patent number 7,858,146
- Issue date Dec 28, 2010
- Rohm and Haas Electronic Materials LLC
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper compositions
- Patent number 7,611,569
- Issue date Nov 3, 2009
- Rohm and Haas Electronic Materials LLC
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper and redox couples
- Patent number 7,527,681
- Issue date May 5, 2009
- Rohm and Haas Electronic Materials LLP
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formaldehyde free electroless copper compositions
- Patent number 7,501,014
- Issue date Mar 10, 2009
- Rohm and Haas Electronic Materials LLC
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,911,068
- Issue date Jun 28, 2005
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,773,573
- Issue date Aug 10, 2004
- Shipley Company, L.L.C.
- David R. Gabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,736,954
- Issue date May 18, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,652,731
- Issue date Nov 25, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electroless methods
- Publication number 20090004382
- Publication date Jan 1, 2009
- Rohm and Haas Electronic Materials L.L.C.
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless copper compositions
- Publication number 20080038452
- Publication date Feb 14, 2008
- Rohm and Haas Electronic Materials L.L.C.
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless copper and redox couples
- Publication number 20080038449
- Publication date Feb 14, 2008
- Rohm and Haas Electronic Materials L.L.C.
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formaldehyde free electroless copper compositions
- Publication number 20080038451
- Publication date Feb 14, 2008
- Rohm and Haas Electronic Materials L.L.C.
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Environmentally friendly electroless copper compositions
- Publication number 20080038450
- Publication date Feb 14, 2008
- Rohm and Haas Electronic Materials L.L.C.
- Mark A. Poole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20050155866
- Publication date Jul 21, 2005
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20050139118
- Publication date Jun 30, 2005
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Desmear and texturing method
- Publication number 20040216761
- Publication date Nov 4, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040206631
- Publication date Oct 21, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040104124
- Publication date Jun 3, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040074778
- Publication date Apr 22, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030102226
- Publication date Jun 5, 2003
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030085132
- Publication date May 8, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030070934
- Publication date Apr 17, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030066756
- Publication date Apr 10, 2003
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Andrew J. Cobley

Person

Patents Grantslast 30 patents

Method of electrolessly depositing metal on the walls of through-holes

Electroless copper compositions

Electroless copper and redox couples

Formaldehyde free electroless copper compositions

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Patents Applicationslast 30 patents

Electroless methods

Electroless copper compositions

Electroless copper and redox couples

Formaldehyde free electroless copper compositions

Environmentally friendly electroless copper compositions

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Desmear and texturing method

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate