Andrew J. Peltoma

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Litchfield, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Plated ground features for integrated lead suspensions
- Patent number 7,384,531
- Issue date Jun 10, 2008
- Hutchinson Technology Incorporated
- Andrew J. Peltoma
- G11 - INFORMATION STORAGE
Information Patent Grant
Electroplating panel with plating thickness-compensation structures
- Patent number 6,966,976
- Issue date Nov 22, 2005
- Hutchinson Technology Incorporated
- Colin M. Mcgraw
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC