TREA

Andrew K W Leung

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  • Markham, CA
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Patents Grantslast 30 patents

  • Information Patent Grant

    Conductor bump method and apparatus
    • Patent number 8,294,266
    • Issue date Oct 23, 2012
    • Advanced Micro Devices, Inc.
    • Roden R. Topacio
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Conductor bump method and apparatus
    • Patent number 7,906,424
    • Issue date Mar 15, 2011
    • Advanced Micro Devices, Inc.
    • Roden R. Topacio
    • H01 - BASIC ELECTRIC ELEMENTS