Andrew Laib

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Fullerton, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Conductive die attach film for large die semiconductor packages and...
- Patent number 9,449,938
- Issue date Sep 20, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METAL CLIP IN INTEGRATED DEVICE PACKAGE FOR GROUNDING AND ELECTROMA...
- Publication number 20240347474
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE WITH METAL CLIP FOR STACKING ELECTRONIC C...
- Publication number 20240347475
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH MOLD ADHESION BOUNDARY FOR DIE ATTACH PAD
- Publication number 20230262901
- Publication date Aug 17, 2023
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
- Publication number 20160148894
- Publication date May 26, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- H01 - BASIC ELECTRIC ELEMENTS