Andrew P. Collins

Person

Durham, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with chiplets coupled to a memory device
- Patent number 12,205,924
- Issue date Jan 21, 2025
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 12,051,647
- Issue date Jul 30, 2024
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 12,046,568
- Issue date Jul 23, 2024
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 11,728,294
- Issue date Aug 15, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable in-plane signal to ground reference configurations
- Patent number 11,705,390
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 11,705,398
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect hub for dies
- Patent number 11,621,223
- Issue date Apr 4, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with chiplets coupled to a memory device
- Patent number 11,610,862
- Issue date Mar 21, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge hub tiling architecture
- Patent number 11,569,173
- Issue date Jan 31, 2023
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory device and method for embedding memory device in a...
- Patent number 11,562,993
- Issue date Jan 24, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel die complex with integrated discrete passive components
- Patent number 11,462,521
- Issue date Oct 4, 2022
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture and processes to enable high capacity memory packages...
- Patent number 11,456,281
- Issue date Sep 27, 2022
- Intel Corporation
- Yí Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded very high density (VHD) layer
- Patent number 11,387,187
- Issue date Jul 12, 2022
- Intel Corporation
- Andrew Paul Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 11,270,942
- Issue date Mar 8, 2022
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-inductance current paths for on-package power distributions and...
- Patent number 11,222,837
- Issue date Jan 11, 2022
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 11,195,805
- Issue date Dec 7, 2021
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory device and method for embedding memory device in a...
- Patent number 11,018,124
- Issue date May 25, 2021
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-delivery methods for embedded multi-die interconnect bridges...
- Patent number 10,847,467
- Issue date Nov 24, 2020
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-inductance current paths for on-package power distributions and...
- Patent number 10,651,117
- Issue date May 12, 2020
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 10,643,945
- Issue date May 5, 2020
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-delivery methods for embedded multi-die interconnect bridges...
- Patent number 10,490,503
- Issue date Nov 26, 2019
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling arrangement
- Patent number 10,015,878
- Issue date Jul 3, 2018
- Intel Corporation
- William L. Barber
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Decoupling arrangement
- Patent number 9,225,164
- Issue date Dec 29, 2015
- Intel Corporation
- William L. Barber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Decoupling arrangement
- Patent number 8,913,364
- Issue date Dec 16, 2014
- Intel Corporation
- William L. Barber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Recreational basketball apparatus with moving goal barrier
- Patent number 4,286,779
- Issue date Sep 1, 1981
- Andrew P. Collins
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Recreational basketball apparatus with multiple moving goals
- Patent number 4,268,029
- Issue date May 19, 1981
- Andrew P. Collins
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Recreational basketball apparatus with moving goal
- Patent number 4,266,764
- Issue date May 12, 1981
- Andrew P. Collins
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Recreational basketball apparatus with moving backboards
- Patent number 4,266,763
- Issue date May 12, 1981
- Andrew P. Collins
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Recreational basketball court facility
- Patent number 4,202,543
- Issue date May 13, 1980
- Andrew P. Collins
- A63 - SPORTS GAMES AMUSEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20240347457
- Publication date Oct 17, 2024
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20240321785
- Publication date Sep 26, 2024
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED DIE WITH INPUT/OUTPUT (I/O) TILES
- Publication number 20240232122
- Publication date Jul 11, 2024
- Intel Corporation
- Andrew Paul Collins
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
- Publication number 20240114622
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20230343731
- Publication date Oct 26, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...
- Publication number 20230299044
- Publication date Sep 21, 2023
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20230290728
- Publication date Sep 14, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA LOW LOSS ROUTING BETWEEN GLASS CORES
- Publication number 20230207405
- Publication date Jun 29, 2023
- Intel Corporation
- Arghya SAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA LOW LOSS AND HIGH-DENSITY ROUTING BETWEEN CORES
- Publication number 20230207406
- Publication date Jun 29, 2023
- Intel Corporation
- Arghya SAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORES
- Publication number 20230207494
- Publication date Jun 29, 2023
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE
- Publication number 20230197682
- Publication date Jun 22, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...
- Publication number 20230197592
- Publication date Jun 22, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED FINS WITH BLIND TRENCH STRUCTURES
- Publication number 20230197593
- Publication date Jun 22, 2023
- Intel Corporation
- Sivaseetharaman PANDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...
- Publication number 20230197646
- Publication date Jun 22, 2023
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE HUB TILING ARCHITECTURE
- Publication number 20230138386
- Publication date May 4, 2023
- Intel Corporation
- ANDREW P. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE DIE TO FLOOR PLANNING WITH BUMP PITCH SCALE THROUGH GLASS...
- Publication number 20230099632
- Publication date Mar 30, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE
- Publication number 20230100576
- Publication date Mar 30, 2023
- Intel Corporation
- Andrew COLLINS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE LAYER COUNT REDUCTION ENABLED WITH BUMP PITCH SCALE THROU...
- Publication number 20230097236
- Publication date Mar 30, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF L...
- Publication number 20230086356
- Publication date Mar 23, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE
- Publication number 20230089096
- Publication date Mar 23, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH PERMEABILITY MAGNETIC REGIONS IN GLASS PATCH FOR ENH...
- Publication number 20230090759
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH FLIPPED HIGH BANDWIDTH MEMORY DEVICE
- Publication number 20230081139
- Publication date Mar 16, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20220148968
- Publication date May 12, 2022
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20220059476
- Publication date Feb 24, 2022
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED DIE WITH INPUT/OUTPUT (I/O) TILES
- Publication number 20210263880
- Publication date Aug 26, 2021
- Intel Corporation
- Andrew Paul Collins
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED MEMORY DEVICE AND METHOD FOR EMBEDDING MEMORY DEVICE IN A...
- Publication number 20210225828
- Publication date Jul 22, 2021
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT HUB FOR DIES
- Publication number 20200373235
- Publication date Nov 26, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE IN-PLANE SIGNAL TO GROUND REFERENCE CONFIGURATIONS
- Publication number 20200312759
- Publication date Oct 1, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-INDUCTANCE CURRENT PATHS FOR ON-PACKAGE POWER DISTRIBUTIONS AND...
- Publication number 20200235048
- Publication date Jul 23, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20200235051
- Publication date Jul 23, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS

Andrew P. Collins

Person

Patents Grantslast 30 patents

Semiconductor packages with chiplets coupled to a memory device

Pitch translation architecture for semiconductor package including...

Capacitor die embedded in package substrate for providing capacitan...

Capacitor die embedded in package substrate for providing capacitan...

Variable in-plane signal to ground reference configurations

Pitch translation architecture for semiconductor package including...

Interconnect hub for dies

Semiconductor packages with chiplets coupled to a memory device

Bridge hub tiling architecture

Embedded memory device and method for embedding memory device in a...

Multilevel die complex with integrated discrete passive components

Architecture and processes to enable high capacity memory packages...

Embedded very high density (VHD) layer

Pitch translation architecture for semiconductor package including...

Low-inductance current paths for on-package power distributions and...

Capacitor die embedded in package substrate for providing capacitan...

Embedded memory device and method for embedding memory device in a...

Power-delivery methods for embedded multi-die interconnect bridges...

Low-inductance current paths for on-package power distributions and...

Pitch translation architecture for semiconductor package including...

Power-delivery methods for embedded multi-die interconnect bridges...

Decoupling arrangement

Decoupling arrangement

Decoupling arrangement

Recreational basketball apparatus with moving goal barrier

Recreational basketball apparatus with multiple moving goals

Recreational basketball apparatus with moving goal

Recreational basketball apparatus with moving backboards

Recreational basketball court facility

Patents Applicationslast 30 patents

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

DISAGGREGATED DIE WITH INPUT/OUTPUT (I/O) TILES

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

ULTRA LOW LOSS ROUTING BETWEEN GLASS CORES

ULTRA LOW LOSS AND HIGH-DENSITY ROUTING BETWEEN CORES

SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORES

SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE

POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...

COUPLED FINS WITH BLIND TRENCH STRUCTURES

LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...

BRIDGE HUB TILING ARCHITECTURE

FLEXIBLE DIE TO FLOOR PLANNING WITH BUMP PITCH SCALE THROUGH GLASS...

THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE

SUBSTRATE LAYER COUNT REDUCTION ENABLED WITH BUMP PITCH SCALE THROU...

GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF L...

MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE

LOCALIZED HIGH PERMEABILITY MAGNETIC REGIONS IN GLASS PATCH FOR ENH...

INTEGRATED CIRCUIT PACKAGE WITH FLIPPED HIGH BANDWIDTH MEMORY DEVICE

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

DISAGGREGATED DIE WITH INPUT/OUTPUT (I/O) TILES

EMBEDDED MEMORY DEVICE AND METHOD FOR EMBEDDING MEMORY DEVICE IN A...

INTERCONNECT HUB FOR DIES

VARIABLE IN-PLANE SIGNAL TO GROUND REFERENCE CONFIGURATIONS

LOW-INDUCTANCE CURRENT PATHS FOR ON-PACKAGE POWER DISTRIBUTIONS AND...

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...