Andrew Stephen Brown

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 12,288,744
- Issue date Apr 29, 2025
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,881,463
- Issue date Jan 23, 2024
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit package supports
- Patent number 11,830,809
- Issue date Nov 28, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with reduced interconnect stress
- Patent number 11,824,013
- Issue date Nov 21, 2023
- Intel Corporation
- Lauren A. Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,804,455
- Issue date Oct 31, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual trace thickness for single layer routing
- Patent number 11,769,719
- Issue date Sep 26, 2023
- Intel Corporation
- Jonathan Rosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,737,208
- Issue date Aug 22, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for package substrates
- Patent number 11,705,389
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin dielectric films using photo up-conversion for applicati...
- Patent number 11,670,504
- Issue date Jun 6, 2023
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of thin film capacitors in organic substrate packages
- Patent number 11,651,902
- Issue date May 16, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich-molded cores for high-inductance architectures
- Patent number 11,622,448
- Issue date Apr 4, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release layer-assisted selective embedding of magnetic material in...
- Patent number 11,610,706
- Issue date Mar 21, 2023
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture utilizing photoimageable dielectric (PID) for...
- Patent number 11,574,874
- Issue date Feb 7, 2023
- Intel Corporation
- Robert A. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric for high density substrate interconnects
- Patent number 11,552,010
- Issue date Jan 10, 2023
- Intel Corporation
- Robert A. May
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Asymmetric cored integrated circuit package supports
- Patent number 11,552,008
- Issue date Jan 10, 2023
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solution based deposition of dielectrics for advanced s...
- Patent number 11,508,636
- Issue date Nov 22, 2022
- Intel Corporation
- Andrew Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,495,552
- Issue date Nov 8, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic bilayer structure for a cored or coreless semiconductor pa...
- Patent number 11,495,555
- Issue date Nov 8, 2022
- Intel Corporation
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit packages
- Patent number 11,444,042
- Issue date Sep 13, 2022
- Intel Corporation
- Andrew James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,380,609
- Issue date Jul 5, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing and caching in an information-centric network
- Patent number 11,316,946
- Issue date Apr 26, 2022
- Intel Corporation
- Sebastian Schoenberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic substrates having embedded magnetic material using photo...
- Patent number 11,289,263
- Issue date Mar 29, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer prepreg for reduced dielectric thickness
- Patent number 11,276,618
- Issue date Mar 15, 2022
- Intel Corporation
- Jonathan Rosch
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,251,113
- Issue date Feb 15, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,205,626
- Issue date Dec 21, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded dielectric magnetic material...
- Patent number 11,189,409
- Issue date Nov 30, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having polymer-derived ceramic core
- Patent number 11,075,130
- Issue date Jul 27, 2021
- Intel Corporation
- Lisa Ying Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including silane based adhesion promoter and m...
- Patent number 10,916,486
- Issue date Feb 9, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
- Publication number 20240014149
- Publication date Jan 11, 2024
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
- Publication number 20230369192
- Publication date Nov 16, 2023
- Intel Corporation
- Jonathan ROSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20230345621
- Publication date Oct 26, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY TAGGING AND TRACKING FOR OFFLOADED FUNCTIONS AND CALLED MOD...
- Publication number 20230100873
- Publication date Mar 30, 2023
- Intel Corporation
- Enrico Galli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20220278038
- Publication date Sep 1, 2022
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20220230951
- Publication date Jul 21, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20220068847
- Publication date Mar 3, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...
- Publication number 20220013265
- Publication date Jan 13, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20210305154
- Publication date Sep 30, 2021
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...
- Publication number 20210134727
- Publication date May 6, 2021
- Robert A. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING AND CACHING IN AN INFORMATION-CENTRIC NETWORK
- Publication number 20210105335
- Publication date Apr 8, 2021
- Intel Corporation
- Sebastian Schoenberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE SUBSTRATE WITH REDUCED INTERCONNECT STRESS
- Publication number 20210050306
- Publication date Feb 18, 2021
- Intel Corporation
- Lauren A. Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH-MOLDED CORES FOR HIGH-INDUCTANCE ARCHITECTURES
- Publication number 20210014972
- Publication date Jan 14, 2021
- Intel Corporation
- Brandon C. MARIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR AN ELECTRONIC DEVICE
- Publication number 20200411413
- Publication date Dec 31, 2020
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THIN FILM CAPACITOR WITH NANOCUBE FILM AND PROCESS FOR FOR...
- Publication number 20200402720
- Publication date Dec 24, 2020
- Intel Corporation
- Brandon C. MARIN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
VIAS FOR PACKAGE SUBSTRATES
- Publication number 20200395282
- Publication date Dec 17, 2020
- Intel Corporation
- Andrew J. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN DIELECTRIC FILMS USING PHOTO UP-CONVERSION FOR APPLICATI...
- Publication number 20200373157
- Publication date Nov 26, 2020
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200279819
- Publication date Sep 3, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20200253037
- Publication date Aug 6, 2020
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20200168536
- Publication date May 28, 2020
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FOR HIGH DENSITY SUBSTRATE INTERCONNECTS
- Publication number 20200118917
- Publication date Apr 16, 2020
- Intel Corpooration
- Robert A. MAY
- C07 - ORGANIC CHEMISTRY
Information Patent Application
3D CONDUCTIVE INK PRINTING METHOD AND INDUCTOR FORMED THEREOF
- Publication number 20200098848
- Publication date Mar 26, 2020
- Chong Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200075511
- Publication date Mar 5, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SOLUTION BASED DEPOSITION OF DIELECTRICS FOR ADVANCED S...
- Publication number 20200006180
- Publication date Jan 2, 2020
- Intel Corporation
- Andrew BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER
- Publication number 20200006211
- Publication date Jan 2, 2020
- Intel Corporation
- Andrew J. BROWN
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
- Publication number 20200006258
- Publication date Jan 2, 2020
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNETIC INDUCTOR
- Publication number 20200006464
- Publication date Jan 2, 2020
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING OF THIN FILM CAPACITORS IN ORGANIC SUBSTRATE PACKAGES
- Publication number 20200006005
- Publication date Jan 2, 2020
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING POLYMER-DERIVED CERAMIC CORE
- Publication number 20190393109
- Publication date Dec 26, 2019
- Intel Corporation
- Lisa Ying Ying CHEN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Andrew Stephen Brown

Person

Patents Grantslast 30 patents

Microelectronic assemblies having conductive structures with differ...

Coreless organic packages with embedded die and magnetic inductor s...

Methods of embedding magnetic structures in substrates

Magnetic structures in integrated circuit package supports

Package substrate with reduced interconnect stress

Substrate integrated thin film capacitors using amorphous high-k di...

Dual trace thickness for single layer routing

Microelectronic assemblies having conductive structures with differ...

Vias for package substrates

Ultra-thin dielectric films using photo up-conversion for applicati...

Patterning of thin film capacitors in organic substrate packages

Sandwich-molded cores for high-inductance architectures

Release layer-assisted selective embedding of magnetic material in...

Package architecture utilizing photoimageable dielectric (PID) for...

Dielectric for high density substrate interconnects

Asymmetric cored integrated circuit package supports

Multi-layer solution based deposition of dielectrics for advanced s...

Substrate integrated thin film capacitors using amorphous high-k di...

Magnetic bilayer structure for a cored or coreless semiconductor pa...

Magnetic structures in integrated circuit packages

Microelectronic assemblies having conductive structures with differ...

Magnetic inductor structures for package devices

Processing and caching in an information-centric network

Electronic substrates having embedded magnetic material using photo...

Bi-layer prepreg for reduced dielectric thickness

Methods of embedding magnetic structures in substrates

Coreless organic packages with embedded die and magnetic inductor s...

Electronic substrates having embedded dielectric magnetic material...

Package substrate having polymer-derived ceramic core

Semiconductor device including silane based adhesion promoter and m...

Patents Applicationslast 30 patents

SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...

DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

MEMORY TAGGING AND TRACKING FOR OFFLOADED FUNCTIONS AND CALLED MOD...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...

MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS

PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...

PROCESSING AND CACHING IN AN INFORMATION-CENTRIC NETWORK

PACKAGE SUBSTRATE WITH REDUCED INTERCONNECT STRESS

SANDWICH-MOLDED CORES FOR HIGH-INDUCTANCE ARCHITECTURES

SUBSTRATE FOR AN ELECTRONIC DEVICE

EMBEDDED THIN FILM CAPACITOR WITH NANOCUBE FILM AND PROCESS FOR FOR...

VIAS FOR PACKAGE SUBSTRATES

ULTRA-THIN DIELECTRIC FILMS USING PHOTO UP-CONVERSION FOR APPLICATI...

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS

DIELECTRIC FOR HIGH DENSITY SUBSTRATE INTERCONNECTS

3D CONDUCTIVE INK PRINTING METHOD AND INDUCTOR FORMED THEREOF

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

MULTI-LAYER SOLUTION BASED DEPOSITION OF DIELECTRICS FOR ADVANCED S...

SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER

SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...

EMBEDDED MAGNETIC INDUCTOR

PATTERNING OF THIN FILM CAPACITORS IN ORGANIC SUBSTRATE PACKAGES

PACKAGE SUBSTRATE HAVING POLYMER-DERIVED CERAMIC CORE