Andrew T. Barfknecht

Person

Menlo Park, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polymer lid wafer-level package with an electrically and thermally...
- Patent number 10,804,875
- Issue date Oct 13, 2020
- Avago Technologies International Sales Pte. Limited
- Stephen Roy Gilbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic resonator including extended cavity
- Patent number 10,256,788
- Issue date Apr 9, 2019
- Avago Technologies International Sales Pte. Limited
- Siamak Fouladi Azarnaminy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device including cavity package with elastic layer within...
- Patent number 9,680,445
- Issue date Jun 13, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Andrew Thomas Barfknecht
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Die singulation using deep silicon etching
- Patent number 6,777,267
- Issue date Aug 17, 2004
- Agilent Technologies, Inc.
- Richard C. Ruby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition to enhance sealing yield of microcap wafer-level pa...
- Patent number 6,777,263
- Issue date Aug 17, 2004
- Agilent Technologies, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cryogenic, high-resolution x-ray detector with high count rate capa...
- Patent number 6,528,814
- Issue date Mar 4, 2003
- The Regents of the University of California
- Matthias Frank
- G01 - MEASURING TESTING
Information Patent Grant
Method for making a monolithic integrated high-T.sub.c superconduct...
- Patent number 6,165,801
- Issue date Dec 26, 2000
- The United States of America as represented by the Secretary of the Navy
- Michael J. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic integrated high-T.sub.c superconductor-semiconductor str...
- Patent number 6,051,846
- Issue date Apr 18, 2000
- The United States of America as represented by the Secretary of the Navy
- Michael J. Burns
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROCAPPED PACKAGE HAVING POLYMER STANDOFF
- Publication number 20190123716
- Publication date Apr 25, 2019
- Avago Technologies General IP (Singapore) PTE. LTD.
- Steven Martin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POLYMER LID WAFER-LEVEL PACKAGE WITH AN ELECTRICALLY AND THERMALLY...
- Publication number 20190103852
- Publication date Apr 4, 2019
- Avago Technologies General IP (Singapore) PTE. LTD.
- Stephen Roy Gilbert
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC RESONATOR INCLUDING EXTENDED CAVITY
- Publication number 20180287584
- Publication date Oct 4, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Siamak Fouladi Azarnaminy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE INCLUDING CAVITY PACKAGE WITH ELASTIC LAYER WITHIN...
- Publication number 20160126443
- Publication date May 5, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Andrew Thomas Barfknecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PASSIVATION OF SUBSTRATE BY MECHANICALLY DAMAGING SURFACE L...
- Publication number 20150014795
- Publication date Jan 15, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Martin FRANOSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die singulation using deep silicon etching
- Publication number 20040087059
- Publication date May 6, 2004
- Richard C. Ruby
- H01 - BASIC ELECTRIC ELEMENTS

Andrew T. Barfknecht

Person

Patents Grantslast 30 patents

Polymer lid wafer-level package with an electrically and thermally...

Acoustic resonator including extended cavity

Packaged device including cavity package with elastic layer within...

Die singulation using deep silicon etching

Film deposition to enhance sealing yield of microcap wafer-level pa...

Cryogenic, high-resolution x-ray detector with high count rate capa...

Method for making a monolithic integrated high-T.sub.c superconduct...

Monolithic integrated high-T.sub.c superconductor-semiconductor str...

Patents Applicationslast 30 patents

MICROCAPPED PACKAGE HAVING POLYMER STANDOFF

POLYMER LID WAFER-LEVEL PACKAGE WITH AN ELECTRICALLY AND THERMALLY...

ACOUSTIC RESONATOR INCLUDING EXTENDED CAVITY

PACKAGED DEVICE INCLUDING CAVITY PACKAGE WITH ELASTIC LAYER WITHIN...

SURFACE PASSIVATION OF SUBSTRATE BY MECHANICALLY DAMAGING SURFACE L...

Die singulation using deep silicon etching