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Andrew Yeohi
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Portland, OR, US
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Patents Grants
last 30 patents
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Patent Grant
Methods of forming stepped bumps and structures formed thereby
Patent number
7,659,192
Issue date
Feb 9, 2010
Intel Corporation
Andrew Yeohi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY
Publication number
20080157392
Publication date
Jul 3, 2008
Andrew Yeohi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of forming stepped bumps and structures formed thereby
Publication number
20080157356
Publication date
Jul 3, 2008
Andrew Yeohi
H01 - BASIC ELECTRIC ELEMENTS