Andy Lok-Fung CHOW

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Tseung Kwan O, HK

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Patents Grantslast 30 patents

Information Patent Grant
Electroless copper plating compositions
- Patent number 9,869,026
- Issue date Jan 16, 2018
- Rohm and Haas Electronic Materials LLC
- David S. Laitar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating compositions
- Patent number 9,702,046
- Issue date Jul 11, 2017
- Dow Global Technologies LLC
- David S. Laitar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formaldehyde free electroless copper plating compositions and methods
- Patent number 9,611,550
- Issue date Apr 4, 2017
- Rohm and Haas Electronic Materials LLC
- Andy Lok-Fung Chow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS COPPER PLATING COMPOSITIONS
- Publication number 20160122876
- Publication date May 5, 2016
- Rohm and Haas Electronic Materials L.L.C.
- David S. LAITAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS COPPER PLATING COMPOSITIONS
- Publication number 20160017498
- Publication date Jan 21, 2016
- Rohm and Haas Electronic Materials L.L.C.
- David S. LAITAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
- Publication number 20140178572
- Publication date Jun 26, 2014
- Rohm and Haas Electronic Materials L.L.C.
- Andy Lok-Fung CHOW
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...