Ang-Ying Lin

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 12,074,137
- Issue date Aug 27, 2024
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier having a stiffener between solder bumps
- Patent number 12,027,470
- Issue date Jul 2, 2024
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna package structure
- Patent number 12,009,341
- Issue date Jun 11, 2024
- Industrial Technology Research Institute
- Po-Kai Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,646,270
- Issue date May 9, 2023
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,587,905
- Issue date Feb 21, 2023
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and manufacturing method thereof
- Patent number 11,569,217
- Issue date Jan 31, 2023
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacture method thereof
- Patent number 11,424,190
- Issue date Aug 23, 2022
- Industrial Technology Research Institute
- Chao-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and manufacturing method thereof
- Patent number 11,251,174
- Issue date Feb 15, 2022
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hetero-integrated structure
- Patent number 11,004,816
- Issue date May 11, 2021
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ANTENNA PACKAGE STRUCTURE
- Publication number 20230197680
- Publication date Jun 22, 2023
- Industrial Technology Research Institute
- Po-Kai Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187409
- Publication date Jun 15, 2023
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE S...
- Publication number 20220367385
- Publication date Nov 17, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220130812
- Publication date Apr 28, 2022
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118860
- Publication date Apr 22, 2021
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111126
- Publication date Apr 15, 2021
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURE METHOD THEREOF
- Publication number 20210111125
- Publication date Apr 15, 2021
- Industrial Technology Research Institute
- Chao-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111153
- Publication date Apr 15, 2021
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME
- Publication number 20200075519
- Publication date Mar 5, 2020
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS

Ang-Ying Lin

Person

Patents Grantslast 30 patents

Multi-chip package and manufacturing method thereof

Package carrier having a stiffener between solder bumps

Integrated antenna package structure

Multi-chip package and manufacturing method thereof

Multi-chip package and manufacturing method thereof

Image sensor package and manufacturing method thereof

Multi-chip package and manufacture method thereof

Image sensor package and manufacturing method thereof

Hetero-integrated structure

Patents Applicationslast 30 patents

INTEGRATED ANTENNA PACKAGE STRUCTURE

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE S...

IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP PACKAGE AND MANUFACTURE METHOD THEREOF

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME