Angel Enverga

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor module having a mold step for increasing creep...
- Patent number 11,621,204
- Issue date Apr 4, 2023
- Infineon Technologies AG
- Oliver Markus Kreiter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL FUNCTIONAL THERMAL PERFORMANCE SEMICONDUCTOR PACKAGE AND RELAT...
- Publication number 20230154827
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR MODULE HAVING A MOLD STEP FOR INCREASING CREEP...
- Publication number 20220262693
- Publication date Aug 18, 2022
- Oliver Markus Kreiter
- H01 - BASIC ELECTRIC ELEMENTS