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Angel Orabuena Alvarez
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Near chip size semiconductor package
Patent number
8,154,111
Issue date
Apr 10, 2012
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package and method for manufacturing same
Patent number
7,045,396
Issue date
May 16, 2006
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated semiconductor package including chip paddle and leads
Patent number
6,753,597
Issue date
Jun 22, 2004
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Near chip size semiconductor package
Patent number
6,639,308
Issue date
Oct 28, 2003
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package and method for manufacturing same
Patent number
6,605,866
Issue date
Aug 12, 2003
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cavity semiconductor package with exposed leads and die pad
Patent number
6,476,478
Issue date
Nov 5, 2002
Amkor Technology, Inc.
Gary L. Swiss
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Near chip size semiconductor package
Publication number
20040056338
Publication date
Mar 25, 2004
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stackable semiconductor package and method for manufacturing same
Publication number
20030197290
Publication date
Oct 23, 2003
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS