Angela Kessler

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including parallel electrically conductive la...
- Patent number 12,237,246
- Issue date Feb 25, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator module with inductor-cooled power stage
- Patent number 12,150,236
- Issue date Nov 19, 2024
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 12,131,988
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor module
- Patent number 12,087,740
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of manufacturing a die package
- Patent number 12,033,909
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with clip having through hole accommodating component-relat...
- Patent number 12,027,436
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a multi-branch switch node connector
- Patent number 12,009,290
- Issue date Jun 11, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 11,848,262
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,817,430
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,664,304
- Issue date May 30, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising chip contact element of two different electrical...
- Patent number 11,056,458
- Issue date Jul 6, 2021
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier with electrically conductive layer extending beyond th...
- Patent number 10,615,097
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier configured for delamination-free encapsulation and sta...
- Patent number 10,586,756
- Issue date Mar 10, 2020
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,283,432
- Issue date May 7, 2019
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package comprising a transistor chip module and a dri...
- Patent number 10,242,969
- Issue date Mar 26, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interconnections having different melting temperatures
- Patent number 10,211,133
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages, chip arrangements, a circuit board, and methods for...
- Patent number 10,128,180
- Issue date Nov 13, 2018
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,074,590
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board embedding a power semiconductor chip
- Patent number 10,062,671
- Issue date Aug 28, 2018
- Infineon Technologies AG
- Martin Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages, chip arrangements, a circuit board, and methods for...
- Patent number 9,859,198
- Issue date Jan 2, 2018
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and method for producing a chip arrangement
- Patent number 9,633,927
- Issue date Apr 25, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electronic chip device with mounting provision and ext...
- Patent number 9,536,816
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including multiple semiconductor chips and a l...
- Patent number 9,263,425
- Issue date Feb 16, 2016
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of current measurement in wiring structure of an electr...
- Patent number 9,140,735
- Issue date Sep 22, 2015
- Infineon Technologies AG
- Martin Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip arrangement and method for producing a chip arrangement
- Patent number 8,519,547
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic-thermosetting composite and method for bonding a ther...
- Patent number 8,507,080
- Issue date Aug 13, 2013
- Infineon Technologies AG
- Joachim Mahler
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor component and production method
- Patent number 8,440,733
- Issue date May 14, 2013
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a stack of semiconductor chips and m...
- Patent number 8,354,299
- Issue date Jan 15, 2013
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and production method
- Patent number 8,178,390
- Issue date May 15, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with at least two substrates
- Patent number 8,017,438
- Issue date Sep 13, 2011
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...
- Publication number 20250183232
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...
- Publication number 20250174509
- Publication date May 29, 2025
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH INDUCTOR-COOLED POWER STAGE
- Publication number 20250048531
- Publication date Feb 6, 2025
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE
- Publication number 20250015008
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Module
- Publication number 20240413127
- Publication date Dec 12, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Package and Method of Manufacturing a Die Package
- Publication number 20240339371
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package with Shielding Pad
- Publication number 20240312799
- Publication date Sep 19, 2024
- INFINEON TECHNOLOGIES AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR CONNECTIVITY AND ASSEMBLIES
- Publication number 20240249870
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Kushal KSHIRSAGAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM
- Publication number 20240105678
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Passive Element with Interposer
- Publication number 20240079310
- Publication date Mar 7, 2024
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Module
- Publication number 20240047431
- Publication date Feb 8, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR POWER DEVICE PACKAGE EMBEDDED IN CIRCUIT CARRIER
- Publication number 20240030820
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE
- Publication number 20230371165
- Publication date Nov 16, 2023
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Thermally Coupled to Passive Element
- Publication number 20230369160
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Device Power Module Arrangement
- Publication number 20230369256
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A MULTI-BRANCH SWITCH NODE CONNECTOR
- Publication number 20230253304
- Publication date Aug 10, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Premolded Leadframe and a Semicon...
- Publication number 20230197577
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Passive Element with Interposer
- Publication number 20220262716
- Publication date Aug 18, 2022
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELAT...
- Publication number 20220254696
- Publication date Aug 11, 2022
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220108945
- Publication date Apr 7, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220093573
- Publication date Mar 24, 2022
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING PARALLEL ELECTRICALLY CONDUCTIVE LA...
- Publication number 20210287964
- Publication date Sep 16, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CAVITY IN ITS PACKAGE BODY
- Publication number 20210035876
- Publication date Feb 4, 2021
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...
- Publication number 20210035879
- Publication date Feb 4, 2021
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Package and Method of Manufacturing a Die Package
- Publication number 20200402881
- Publication date Dec 24, 2020
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING CHIP CONTACT ELEMENT OF TWO DIFFERENT ELECTRICAL...
- Publication number 20200176412
- Publication date Jun 4, 2020
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20190157192
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded package with chip carrier comprising brazed electrically con...
- Publication number 20190006260
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Mark PAVIER
- B60 - VEHICLES IN GENERAL
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20180138111
- Publication date May 17, 2018
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS

Angela Kessler

Person

Patents Grantslast 30 patents

Semiconductor devices including parallel electrically conductive la...

Voltage regulator module with inductor-cooled power stage

Semiconductor package and passive element with interposer

Method of forming a semiconductor module

Die package and method of manufacturing a die package

Package with clip having through hole accommodating component-relat...

Semiconductor module having a multi-branch switch node connector

Semiconductor package and passive element with interposer

Semiconductor module

Semiconductor module

Package comprising chip contact element of two different electrical...

Chip carrier with electrically conductive layer extending beyond th...

Chip carrier configured for delamination-free encapsulation and sta...

Molded package with chip carrier comprising brazed electrically con...

Semiconductor package comprising a transistor chip module and a dri...

Package with interconnections having different melting temperatures

Chip packages, chip arrangements, a circuit board, and methods for...

Molded package with chip carrier comprising brazed electrically con...

Circuit board embedding a power semiconductor chip

Chip packages, chip arrangements, a circuit board, and methods for...

Chip arrangement and method for producing a chip arrangement

Encapsulated electronic chip device with mounting provision and ext...

Semiconductor device including multiple semiconductor chips and a l...

Integration of current measurement in wiring structure of an electr...

Chip arrangement and method for producing a chip arrangement

Thermoplastic-thermosetting composite and method for bonding a ther...

Semiconductor component and production method

Semiconductor component having a stack of semiconductor chips and m...

Semiconductor component and production method

Semiconductor module with at least two substrates

Patents Applicationslast 30 patents

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...

ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...

POWER MODULE WITH INDUCTOR-COOLED POWER STAGE

DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE

Method of Forming a Semiconductor Module

Die Package and Method of Manufacturing a Die Package

Embedded Package with Shielding Pad

INDUCTOR CONNECTIVITY AND ASSEMBLIES

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM

Semiconductor Package and Passive Element with Interposer

Method of Forming a Semiconductor Module

MODULAR POWER DEVICE PACKAGE EMBEDDED IN CIRCUIT CARRIER

VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE

Semiconductor Device Package Thermally Coupled to Passive Element

Multi-Device Power Module Arrangement

SEMICONDUCTOR MODULE HAVING A MULTI-BRANCH SWITCH NODE CONNECTOR

Semiconductor Devices Including a Premolded Leadframe and a Semicon...

Semiconductor Package and Passive Element with Interposer

PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELAT...

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICES INCLUDING PARALLEL ELECTRICALLY CONDUCTIVE LA...

SEMICONDUCTOR PACKAGE INCLUDING A CAVITY IN ITS PACKAGE BODY

ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...

Die Package and Method of Manufacturing a Die Package

PACKAGE COMPRISING CHIP CONTACT ELEMENT OF TWO DIFFERENT ELECTRICAL...

Package with interconnections having different melting temperatures

Molded package with chip carrier comprising brazed electrically con...

Package with interconnections having different melting temperatures