Angelo Villani

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Shrewsbury, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Dual interposer packaging for high density interconnect
- Patent number 6,812,485
- Issue date Nov 2, 2004
- Hewlett-Packard Development Company, L.P.
- Sharad M. Shah
- G01 - MEASURING TESTING
Information Patent Grant
Clip-on heat sink
- Patent number 5,329,426
- Issue date Jul 12, 1994
- Digital Equipment Corporation
- Angelo Villani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dual interposer packaging for high density interconnect
- Publication number 20030123231
- Publication date Jul 3, 2003
- Sharad M. Shah
- G01 - MEASURING TESTING