Aniela Bryzek

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Hayward, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Device for use as dual-sided sensor package
- Patent number 8,264,074
- Issue date Sep 11, 2012
- General Electric Company
- Woojin Kim
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Surface mount package and method for forming multi-chip microsensor...
- Patent number 7,157,312
- Issue date Jan 2, 2007
- General Electric Company
- Woojin Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surface mount package and method for forming multi-chip microsensor...
- Patent number 6,927,482
- Issue date Aug 9, 2005
- General Electric Company
- Woojin Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR USE AS DUAL-SIDED SENSOR PACKAGE
- Publication number 20120061775
- Publication date Mar 15, 2012
- Woojin KIM
- B60 - VEHICLES IN GENERAL
Information Patent Application
Surface mount package and method for forming multi-chip microsensor...
- Publication number 20050146000
- Publication date Jul 7, 2005
- Woojin Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL