Anindya Dasgupta

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differentiated voltage threshold metal gate structures for advanced...
- Patent number 11,342,445
- Issue date May 24, 2022
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structures for advanced integrated circuit structur...
- Patent number 10,854,732
- Issue date Dec 1, 2020
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differentiated voltage threshold metal gate structures for advanced...
- Patent number 10,741,669
- Issue date Aug 11, 2020
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structures for advanced integrated circuit structur...
- Patent number 10,727,313
- Issue date Jul 28, 2020
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using materials with different etch rates to fill trenches in semic...
- Patent number 9,704,798
- Issue date Jul 11, 2017
- Intel Corporation
- Sridhar Govindaraju
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRENCH CONNECTION OVER DISCONNECTED EPITAXIAL STRUCTURE USING DIREC...
- Publication number 20240421201
- Publication date Dec 19, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA PATTERNING FOR BACKSIDE INTERCONNECTS
- Publication number 20240404917
- Publication date Dec 5, 2024
- Intel Corporation
- Sikandar Abbas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20240186403
- Publication date Jun 6, 2024
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20210043754
- Publication date Feb 11, 2021
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED VOLTAGE THRESHOLD METAL GATE STRUCTURES FOR ADVANCED...
- Publication number 20200335603
- Publication date Oct 22, 2020
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20200321449
- Publication date Oct 8, 2020
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED VOLTAGE THRESHOLD METAL GATE STRUCTURES FOR ADVANCED...
- Publication number 20190164968
- Publication date May 30, 2019
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20190164969
- Publication date May 30, 2019
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING MATERIALS WITH DIFFERENT ETCH RATES TO FILL TRENCHES IN SEMIC...
- Publication number 20150179567
- Publication date Jun 25, 2015
- Sridhar Govindaraju
- H01 - BASIC ELECTRIC ELEMENTS

Anindya Dasgupta

Person

Patents Grantslast 30 patents

Dual metal gate structure having portions of metal gate layers in c...

Differentiated voltage threshold metal gate structures for advanced...

Dual metal gate structures for advanced integrated circuit structur...

Differentiated voltage threshold metal gate structures for advanced...

Dual metal gate structures for advanced integrated circuit structur...

Using materials with different etch rates to fill trenches in semic...

Patents Applicationslast 30 patents

TRENCH CONNECTION OVER DISCONNECTED EPITAXIAL STRUCTURE USING DIREC...

SELF-ALIGNED VIA PATTERNING FOR BACKSIDE INTERCONNECTS

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

DIFFERENTIATED VOLTAGE THRESHOLD METAL GATE STRUCTURES FOR ADVANCED...

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

DIFFERENTIATED VOLTAGE THRESHOLD METAL GATE STRUCTURES FOR ADVANCED...

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

USING MATERIALS WITH DIFFERENT ETCH RATES TO FILL TRENCHES IN SEMIC...