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Anis Fauzi Abdul Aziz
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Kangar, MY
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Patents Grants
last 30 patents
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Patent Grant
Making a flat no-lead package with exposed electroplated side lead...
Patent number
11,348,806
Issue date
May 31, 2022
Texas Instruments Incorporated
Lee Han Meng@ Eugene Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Integrated circuit package
Patent number
9,029,990
Issue date
May 12, 2015
Texas Instruments Incorporated
Lee Hang Meng@Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
MAKING A FLAT NO-LEAD PACKAGE WITH EXPOSED ELECTROPLATED SIDE LEAD...
Publication number
20160181122
Publication date
Jun 23, 2016
TEXAS INSTRUMENTS INCORPORATED
Lee Han Meng@ Eugene Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE
Publication number
20140191378
Publication date
Jul 10, 2014
TEXAS INSTRUMENTS INCORPORATED
Han Meng@Eugene Lee Lee
H01 - BASIC ELECTRIC ELEMENTS