ANIS FAUZI BIN ABDUL AZIZ

Person

KEDAH, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leads for leadframe and semiconductor package
- Patent number 11,830,791
- Issue date Nov 28, 2023
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor package molds
- Patent number 11,791,170
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 11,742,263
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting a leadframe assembly with a plurality of punching tools
- Patent number 11,626,350
- Issue date Apr 11, 2023
- Texas Instruments Incorporated
- Chong Han Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigitated outward and inward bent leads for packaged electroni...
- Patent number 11,569,154
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with lead pitch gap
- Patent number 11,569,152
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe strip
- Patent number 11,373,940
- Issue date Jun 28, 2022
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 11,264,310
- Issue date Mar 1, 2022
- Texas Instruments Incorporated
- Lee Han Meng Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking dual leadframe for flip chip on leadframe packages
- Patent number 11,056,462
- Issue date Jul 6, 2021
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 10,879,154
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe strip
- Patent number 10,784,190
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of assembling a flip chip on a locking dual leadframe
- Patent number 10,541,225
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip with vertically offset die attach pads between adja...
- Patent number 10,115,660
- Issue date Oct 30, 2018
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having leadframe features preventing...
- Patent number 9,892,936
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- Wei Fen Sueann Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly
- Patent number 9,842,807
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip with vertically offset die attach pads between adja...
- Patent number 9,741,643
- Issue date Aug 22, 2017
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a panel of triple stack semiconductor packages
- Patent number 9,691,748
- Issue date Jun 27, 2017
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having leadframe features preventing...
- Patent number 9,515,009
- Issue date Dec 6, 2016
- Texas Instruments Incorporated
- Sueann Lim Wei Fen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 9,496,206
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triple stack semiconductor package
- Patent number 9,324,640
- Issue date Apr 26, 2016
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 9,275,983
- Issue date Mar 1, 2016
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERDIGITATED OUTWARD AND INWARD BENT LEADS FOR PACKAGED ELECTRONI...
- Publication number 20220384317
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZE...
- Publication number 20220223503
- Publication date Jul 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZE...
- Publication number 20210384110
- Publication date Dec 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
- Publication number 20210242038
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi BIN ABDUL AZIZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME ASSEMBLY
- Publication number 20210202356
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Chong Han LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flippable Leadframe for Packaged Electronic System Having Verticall...
- Publication number 20210074613
- Publication date Mar 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
- Publication number 20210043466
- Publication date Feb 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi BIN ABDUL AZIZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING LEADFRAME STRIP
- Publication number 20210005540
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH LEAD PITCH GAP
- Publication number 20200235042
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADS FOR LEADFRAME AND SEMICONDUCTOR PACKAGE
- Publication number 20200135621
- Publication date Apr 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170358523
- Publication date Dec 14, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20170345790
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170345743
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20170309595
- Publication date Oct 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170213784
- Publication date Jul 27, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170110408
- Publication date Apr 20, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Having Leadframe Features Preventing...
- Publication number 20170053814
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- SUEANN LIM WEI FEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flippable Leadframe for Packaged Electronic System Having Verticall...
- Publication number 20170025332
- Publication date Jan 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPPABLE LEADFRAME FOR PACKAGED ELECTRONIC SYSTEM HAVING VERTICALL...
- Publication number 20160300784
- Publication date Oct 13, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING...
- Publication number 20160204052
- Publication date Jul 14, 2016
- TEXAS INSTRUMENTS INCORPORATED
- SUEANN LIM WEI FEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A PANEL OF TRIPLE STACK SEMICONDUCTOR PACKAGES
- Publication number 20160133617
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- LEE HAN MENG @ EUGENE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIPLE STACK SEMICONDUCTOR PACKAGE
- Publication number 20160126230
- Publication date May 5, 2016
- TEXAS INSTRUMENTS INCORPORATED
- LEE HAN MENG @ EUGENE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20150243641
- Publication date Aug 27, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20150060123
- Publication date Mar 5, 2015
- TEXAS INSTRUMENTS INCORPORATED
- LEE HAN MENG @ EUGENE LEE
- H01 - BASIC ELECTRIC ELEMENTS

ANIS FAUZI BIN ABDUL AZIZ

Person

Patents Grantslast 30 patents

Spring bar leadframe, method and packaged electronic device with ze...

Leads for leadframe and semiconductor package

Universal semiconductor package molds

Flippable leadframe for packaged electronic system having verticall...

Cutting a leadframe assembly with a plurality of punching tools

Interdigitated outward and inward bent leads for packaged electroni...

Electronic device with lead pitch gap

Method of making leadframe strip

Spring bar leadframe, method and packaged electronic device with ze...

Locking dual leadframe for flip chip on leadframe packages

Flippable leadframe for packaged electronic system having verticall...

Method of making leadframe strip

Methods of assembling a flip chip on a locking dual leadframe

Leadframe strip with vertically offset die attach pads between adja...

Packaged semiconductor device having leadframe features preventing...

Integrated circuit assembly

Leadframe strip with vertically offset die attach pads between adja...

Forming a panel of triple stack semiconductor packages

Packaged semiconductor device having leadframe features preventing...

Flippable leadframe for packaged electronic system having verticall...

Triple stack semiconductor package

Integrated circuit package

Patents Applicationslast 30 patents

INTERDIGITATED OUTWARD AND INWARD BENT LEADS FOR PACKAGED ELECTRONI...

SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZE...

SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZE...

UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS

LEADFRAME ASSEMBLY

Flippable Leadframe for Packaged Electronic System Having Verticall...

UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS

METHOD OF MAKING LEADFRAME STRIP

ELECTRONIC DEVICE WITH LEAD PITCH GAP

LEADS FOR LEADFRAME AND SEMICONDUCTOR PACKAGE

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

INTEGRATED CIRCUIT ASSEMBLY

Packaged Semiconductor Device Having Leadframe Features Preventing...

Flippable Leadframe for Packaged Electronic System Having Verticall...

FLIPPABLE LEADFRAME FOR PACKAGED ELECTRONIC SYSTEM HAVING VERTICALL...

PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING...

FORMING A PANEL OF TRIPLE STACK SEMICONDUCTOR PACKAGES

TRIPLE STACK SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES