Ankur AGGARWAL

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multicomponent photonically intra-die bridged assembly
- Patent number 12,242,122
- Issue date Mar 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical bridging element for separately stacked electrical ICs
- Patent number 12,216,318
- Issue date Feb 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,189,198
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,136,617
- Issue date Nov 5, 2024
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,130,485
- Issue date Oct 29, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge with optical interface
- Patent number 12,124,095
- Issue date Oct 22, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge (OMIB)
- Patent number 11,835,777
- Issue date Dec 5, 2023
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY
- Publication number 20240272393
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY
- Publication number 20240272392
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS
- Publication number 20240219664
- Publication date Jul 4, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240153934
- Publication date May 9, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240145393
- Publication date May 2, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED USING A PARTIAL PLUG THAT EXTENDS INTO A SUBSTRATE
- Publication number 20240038657
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
- Publication number 20240038695
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...
- Publication number 20240038694
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...
- Publication number 20240027711
- Publication date Jan 25, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE
- Publication number 20230418010
- Publication date Dec 28, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)
- Publication number 20230296854
- Publication date Sep 21, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS

Ankur AGGARWAL

Person

Patents Grantslast 30 patents

Multicomponent photonically intra-die bridged assembly

Optical bridging element for separately stacked electrical ICs

Manufacturing optically accessible co-packaged optics

Manufacturing optically accessible co-packaged optics

Electrical bridge package with integrated off-bridge photonic chann...

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

Electrical bridge package with integrated off-bridge photonic chann...

Stacked-dies optically bridged multicomponent package

Optical multi-die interconnect bridge with optical interface

Optical multi-die interconnect bridge (OMIB)

Patents Applicationslast 30 patents

MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY

MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY

OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

VIA FORMED USING A PARTIAL PLUG THAT EXTENDS INTO A SUBSTRATE

VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS

THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE

OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)