Ankur AGGARWAL

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optically bridged multicomponent package with extended temperature...
- Patent number 12,298,608
- Issue date May 13, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G01 - MEASURING TESTING
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,283,584
- Issue date Apr 22, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicomponent photonically intra-die bridged assembly
- Patent number 12,242,122
- Issue date Mar 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical bridging element for separately stacked electrical ICs
- Patent number 12,216,318
- Issue date Feb 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,189,198
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,136,617
- Issue date Nov 5, 2024
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,130,485
- Issue date Oct 29, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge with optical interface
- Patent number 12,124,095
- Issue date Oct 22, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge (OMIB)
- Patent number 11,835,777
- Issue date Dec 5, 2023
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231431
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231430
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231432
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231429
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...
- Publication number 20250216632
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Application
EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...
- Publication number 20250216598
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS
- Publication number 20250123453
- Publication date Apr 17, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Application
MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS
- Publication number 20250123452
- Publication date Apr 17, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY
- Publication number 20240272392
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY
- Publication number 20240272393
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS
- Publication number 20240219664
- Publication date Jul 4, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240153934
- Publication date May 9, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240145393
- Publication date May 2, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED USING A PARTIAL PLUG THAT EXTENDS INTO A SUBSTRATE
- Publication number 20240038657
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
- Publication number 20240038695
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...
- Publication number 20240038694
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...
- Publication number 20240027711
- Publication date Jan 25, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE
- Publication number 20230418010
- Publication date Dec 28, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)
- Publication number 20230296854
- Publication date Sep 21, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS

Ankur AGGARWAL

Person

Patents Grantslast 30 patents

Optically bridged multicomponent package with extended temperature...

Electrical bridge package with integrated off-bridge photonic chann...

Multicomponent photonically intra-die bridged assembly

Optical bridging element for separately stacked electrical ICs

Manufacturing optically accessible co-packaged optics

Manufacturing optically accessible co-packaged optics

Electrical bridge package with integrated off-bridge photonic chann...

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

Electrical bridge package with integrated off-bridge photonic chann...

Stacked-dies optically bridged multicomponent package

Optical multi-die interconnect bridge with optical interface

Optical multi-die interconnect bridge (OMIB)

Patents Applicationslast 30 patents

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...

EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...

MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS

MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS

MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY

MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY

OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

VIA FORMED USING A PARTIAL PLUG THAT EXTENDS INTO A SUBSTRATE

VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS

THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE

OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)