Ann N. McDonald

Person

New Windsor, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bilayer cap structure including HDP/bHDP films for conductive metal...
- Patent number 7,179,760
- Issue date Feb 20, 2007
- International Buisness Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene interconnect structure using low stress fluorosilica...
- Patent number 7,034,400
- Issue date Apr 25, 2006
- International Business Machines Corporation
- Edward P. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Patent number 6,939,797
- Issue date Sep 6, 2005
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures...
- Patent number 6,914,320
- Issue date Jul 5, 2005
- International Business Machines Corporation
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures...
- Patent number 6,887,783
- Issue date May 3, 2005
- International Business Machines Corporation
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Patent number 6,737,747
- Issue date May 18, 2004
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO REDUCE PLASMA CHARGE DAMAGE FROM HIGH DENSITY PLASMA CHEM...
- Publication number 20080146039
- Publication date Jun 19, 2008
- Daewon Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METAL...
- Publication number 20060270245
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Publication number 20040173908
- Publication date Sep 9, 2004
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structur...
- Publication number 20040173907
- Publication date Sep 9, 2004
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures...
- Publication number 20040115873
- Publication date Jun 17, 2004
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene interconnect structure using low stress fluorosilica...
- Publication number 20040061235
- Publication date Apr 1, 2004
- Edward P. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Publication number 20030132510
- Publication date Jul 17, 2003
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structur...
- Publication number 20030134499
- Publication date Jul 17, 2003
- International Business Machines Corporation
- Tze-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE INTERCONNECT STRUCTURE USING LOW STRESS FLOUROSILICA...
- Publication number 20020076917
- Publication date Jun 20, 2002
- EDWARD P BARTH
- H01 - BASIC ELECTRIC ELEMENTS

Ann N. McDonald

Person

Patents Grantslast 30 patents

Bilayer cap structure including HDP/bHDP films for conductive metal...

Dual damascene interconnect structure using low stress fluorosilica...

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures...

Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures...

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Patents Applicationslast 30 patents

METHOD TO REDUCE PLASMA CHARGE DAMAGE FROM HIGH DENSITY PLASMA CHEM...

BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METAL...

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structur...

Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures...

Dual damascene interconnect structure using low stress fluorosilica...

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structur...

DUAL DAMASCENE INTERCONNECT STRUCTURE USING LOW STRESS FLOUROSILICA...