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Anna M. George
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Sunnyvale, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Healing of micro-cracks in an on-chip dielectric
Patent number
6,975,017
Issue date
Dec 13, 2005
Intel Corporation
Steven N. Towle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of sacrificial inorganic dielectrics for dual damascene process...
Patent number
6,812,131
Issue date
Nov 2, 2004
Honeywell International Inc.
Joseph Travis Kennedy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Healing of micro-cracks in an on-chip dielectric
Patent number
6,806,168
Issue date
Oct 19, 2004
Intel Corporation
Steven N. Towle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polycarbosilane adhesion promoters for low dielectric constant poly...
Patent number
6,780,517
Issue date
Aug 24, 2004
Honeywell International Inc.
Tian-An Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Polycarbosilane adhesion promoters for low dielectric constant poly...
Patent number
6,761,975
Issue date
Jul 13, 2004
Honeywell International Inc.
Tian-An Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for cleaning semiconductor wafers containing dielectric films
Patent number
6,152,148
Issue date
Nov 28, 2000
Honeywell, Inc.
Anna M. George
C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Patents Applications
last 30 patents
Information
Patent Application
THINNED DIE INTEGRATED CIRCUIT PACKAGE
Publication number
20080153209
Publication date
Jun 26, 2008
Intel Corporation
Cheng-Yi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Processing Thick ILD Layers Using Spray Coating or Lamin...
Publication number
20070190776
Publication date
Aug 16, 2007
Intel Corporation
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thick metal layer integrated process flow to improve power delivery...
Publication number
20060076678
Publication date
Apr 13, 2006
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming vertically aligned liquid crystal mixtures
Publication number
20060068518
Publication date
Mar 30, 2006
Anna M. George
G02 - OPTICS
Information
Patent Application
On-substrate microlens to couple an off-substrate light emitter and...
Publication number
20060067606
Publication date
Mar 30, 2006
Intel Corporation
Steven Towle
G02 - OPTICS
Information
Patent Application
Waveguide coupling mechanism
Publication number
20060051021
Publication date
Mar 9, 2006
Henning Braunisch
G02 - OPTICS
Information
Patent Application
Methods of processing thick ILD layers using spray coating or lamin...
Publication number
20060012039
Publication date
Jan 19, 2006
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL THICK FILM STANDING-WAVE CLOCKING
Publication number
20050266675
Publication date
Dec 1, 2005
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer support and release in wafer processing
Publication number
20050221598
Publication date
Oct 6, 2005
Daoqiang Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package substrate pattern to accommodate optical waveguide
Publication number
20050161789
Publication date
Jul 28, 2005
Steven Towle
G02 - OPTICS
Information
Patent Application
Die exhibiting an effective coefficient of thermal expansion equiva...
Publication number
20050136640
Publication date
Jun 23, 2005
Chuan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Underfill integration for optical packages
Publication number
20050127528
Publication date
Jun 16, 2005
Daoqiang Lu
G02 - OPTICS
Information
Patent Application
Thinned die integrated circuit package
Publication number
20050121778
Publication date
Jun 9, 2005
Intel Corporation
Cheng-Yi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-level thick film standing-wave clocking
Publication number
20050070087
Publication date
Mar 31, 2005
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thick metal layer integrated process flow to improve power delivery...
Publication number
20050051894
Publication date
Mar 10, 2005
Intel Corporation
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of processing thick ILD layers using spray coating or lamin...
Publication number
20050051904
Publication date
Mar 10, 2005
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Healing of micro-cracks in an on-chip dielectric
Publication number
20050023565
Publication date
Feb 3, 2005
Steven N. Towle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Computer system implemented on flex tape
Publication number
20040262727
Publication date
Dec 30, 2004
David P. McConville
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Underfill integration for optical packages
Publication number
20040266062
Publication date
Dec 30, 2004
Daoqiang Lu
G02 - OPTICS
Information
Patent Application
Healing of micro-cracks in an on-chip dielectric
Publication number
20040099877
Publication date
May 27, 2004
Steven N. Towle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Polycarbosilane adhesion promoters for low dielectric constant poly...
Publication number
20020198353
Publication date
Dec 26, 2002
Honeywell International Inc.
Tian-An Chen
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...