Anna M. Prakash

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual collimating lens configuration for optical devices
- Patent number 11,579,426
- Issue date Feb 14, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Grant
Compound parabolic concentrator including protrusion
- Patent number 11,156,815
- Issue date Oct 26, 2021
- Intel Corporation
- Chia-Pin Chiu
- G01 - MEASURING TESTING
Information Patent Grant
Coupling a magnet with a MEMS device
- Patent number 11,022,792
- Issue date Jun 1, 2021
- Intel Corporation
- Kyle Yazzie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,615,128
- Issue date Apr 7, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and system for storing and transporting magnetic devices
- Patent number 10,315,200
- Issue date Jun 11, 2019
- Intel Corporation
- Amanuel M Abebaw
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Grant
Coated probe tips for plunger pins of an integrated circuit package...
- Patent number 10,168,357
- Issue date Jan 1, 2019
- Intel Corporation
- Wen Yin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 10,049,971
- Issue date Aug 14, 2018
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an EMI shielding layer
- Patent number 9,991,211
- Issue date Jun 5, 2018
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 9,953,929
- Issue date Apr 24, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perforated conductive material for EMI shielding of semiconductor d...
- Patent number 9,704,811
- Issue date Jul 11, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an EMI shielding layer
- Patent number 9,685,413
- Issue date Jun 20, 2017
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wafer level underfill materials and structures f...
- Patent number 9,631,065
- Issue date Apr 25, 2017
- Intel Corporation
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods of forming an interconnect between a workpiec...
- Patent number 8,183,697
- Issue date May 22, 2012
- Intel Corporation
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods of forming an interconnect between a workpiec...
- Patent number 7,843,075
- Issue date Nov 30, 2010
- Intel Corporation
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package thermal interface materials with dielectric obstructio...
- Patent number 7,776,657
- Issue date Aug 17, 2010
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amphiphilic block copolymers for improved flux application
- Patent number 7,651,020
- Issue date Jan 26, 2010
- Intel Corporation
- Linda A. Shekhawat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package thermal interface materials with dielectric obstructio...
- Patent number 7,332,807
- Issue date Feb 19, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving a liquid crystal display
- Patent number 6,717,561
- Issue date Apr 6, 2004
- Three-Five Systems, Inc.
- Matthias Pfeiffer
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FRO...
- Publication number 20230084375
- Publication date Mar 16, 2023
- Intel Corporation
- Priyanka Dobriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR MICRO LED LASER RELEASE
- Publication number 20230049007
- Publication date Feb 16, 2023
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THE...
- Publication number 20220416503
- Publication date Dec 29, 2022
- Intel Corporation
- Priyanka DOBRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COLLIMATING LENS CONFIGURATION FOR OPTICAL DEVICES
- Publication number 20200348498
- Publication date Nov 5, 2020
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
COMPOUND PARABOLIC CONCENTRATOR INCLUDING PROTRUSION
- Publication number 20200073099
- Publication date Mar 5, 2020
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
COUPLING A MAGNET WITH A MEMS DEVICE
- Publication number 20190391386
- Publication date Dec 26, 2019
- Intel Corporation
- Kyle Yazzie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COUPLING OPTOELECTRONIC COMPONENTS USING TEMPLATED PRESSURE SENSITI...
- Publication number 20190002735
- Publication date Jan 3, 2019
- Intel Corporation
- Mohit Gupta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUS AND SYSTEM FOR STRORING AND TRANSPORTING MAGNETIC DEVICES
- Publication number 20190001342
- Publication date Jan 3, 2019
- Intel Corporation
- Amanuel M. Abebaw
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
FLAT NON-OPTICAL SURFACE OF AN OPTICAL COMPONENT
- Publication number 20180364438
- Publication date Dec 20, 2018
- Intel Corporation
- Yang Sun
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180342463
- Publication date Nov 29, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING FOR SEMICONDUCTOR OPTOELECTRONIC DEVICES AND PACKAGES
- Publication number 20180235075
- Publication date Aug 16, 2018
- Intel Corporation
- Taylor Gaines
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20180226358
- Publication date Aug 9, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180190593
- Publication date Jul 5, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER
- Publication number 20170287851
- Publication date Oct 5, 2017
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20170271270
- Publication date Sep 21, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SQUEEGEE HEAD APPARATUS FOR PRINTING MATERIALS
- Publication number 20170266948
- Publication date Sep 21, 2017
- Intel Corporation
- Joshua D. Heppner
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...
- Publication number 20170250145
- Publication date Aug 31, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20170207152
- Publication date Jul 20, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...
- Publication number 20170179040
- Publication date Jun 22, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coated Probe Tips for Plunger Pins of an Integrated Circuit Package...
- Publication number 20170176495
- Publication date Jun 22, 2017
- Intel Corporation
- Wen Yin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES F...
- Publication number 20140264827
- Publication date Sep 18, 2014
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus And Methods Of Forming An Interconnect Between A Workpiec...
- Publication number 20110074023
- Publication date Mar 31, 2011
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and methods of forming an interconnect between a workpiec...
- Publication number 20090273914
- Publication date Nov 5, 2009
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AMPHIPHILIC BLOCK COPOLYMERS FOR IMPROVED FLUX APPLICATION
- Publication number 20090169721
- Publication date Jul 2, 2009
- Linda A. SHEKHAWAT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux precoated solder preform for thermal interface material
- Publication number 20080239660
- Publication date Oct 2, 2008
- Lateef Mustapha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FLUX COMPOSITION AND PROCESS OF USING SAME
- Publication number 20080156852
- Publication date Jul 3, 2008
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Initiated Thin Polymeric Films for Chemical Sensors
- Publication number 20070286546
- Publication date Dec 13, 2007
- Jean-Francois Masson
- G01 - MEASURING TESTING
Information Patent Application
Solder flux composition
- Publication number 20070284412
- Publication date Dec 13, 2007
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip package thermal interface materials with dielectric obstructio...
- Publication number 20070158823
- Publication date Jul 12, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS

Anna M. Prakash

Person

Patents Grantslast 30 patents

Dual collimating lens configuration for optical devices

Compound parabolic concentrator including protrusion

Coupling a magnet with a MEMS device

Systems and methods for electromagnetic interference shielding

Apparatus and system for storing and transporting magnetic devices

Coated probe tips for plunger pins of an integrated circuit package...

Package structure to enhance yield of TMI interconnections

Semiconductor package having an EMI shielding layer

Systems and methods for electromagnetic interference shielding

Perforated conductive material for EMI shielding of semiconductor d...

Semiconductor package having an EMI shielding layer

Methods of forming wafer level underfill materials and structures f...

Package structure to enhance yield of TMI interconnections

Apparatus and methods of forming an interconnect between a workpiec...

Apparatus and methods of forming an interconnect between a workpiec...

Chip package thermal interface materials with dielectric obstructio...

Amphiphilic block copolymers for improved flux application

Chip package thermal interface materials with dielectric obstructio...

Driving a liquid crystal display

Patents Applicationslast 30 patents

SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FRO...

STRUCTURES FOR MICRO LED LASER RELEASE

MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THE...

DUAL COLLIMATING LENS CONFIGURATION FOR OPTICAL DEVICES

COMPOUND PARABOLIC CONCENTRATOR INCLUDING PROTRUSION

COUPLING A MAGNET WITH A MEMS DEVICE

COUPLING OPTOELECTRONIC COMPONENTS USING TEMPLATED PRESSURE SENSITI...

APPARATUS AND SYSTEM FOR STRORING AND TRANSPORTING MAGNETIC DEVICES

FLAT NON-OPTICAL SURFACE OF AN OPTICAL COMPONENT

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

SHIELDING FOR SEMICONDUCTOR OPTOELECTRONIC DEVICES AND PACKAGES

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER

SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING

MODULAR SQUEEGEE HEAD APPARATUS FOR PRINTING MATERIALS

PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...

Package Structure To Enhance Yield of TMI Interconnections

PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...

Coated Probe Tips for Plunger Pins of an Integrated Circuit Package...

Package Structure To Enhance Yield of TMI Interconnections

METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES F...

Apparatus And Methods Of Forming An Interconnect Between A Workpiec...

Apparatus and methods of forming an interconnect between a workpiec...

AMPHIPHILIC BLOCK COPOLYMERS FOR IMPROVED FLUX APPLICATION

Flux precoated solder preform for thermal interface material

SOLDER FLUX COMPOSITION AND PROCESS OF USING SAME

Surface Initiated Thin Polymeric Films for Chemical Sensors

Solder flux composition

Chip package thermal interface materials with dielectric obstructio...