Anne E. Augustine

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate inductor having thermal interconnect structures
- Patent number 11,690,165
- Issue date Jun 27, 2023
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate inductor having thermal interconnect structures
- Patent number 11,357,096
- Issue date Jun 7, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package inductor having thermal solution structures
- Patent number 11,335,620
- Issue date May 17, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...
- Publication number 20240063183
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR IN A SUBSTRATE VIA
- Publication number 20230319997
- Publication date Oct 5, 2023
- Intel Corporation
- Aslam HASWAREY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20220293327
- Publication date Sep 15, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES
- Publication number 20220240370
- Publication date Jul 28, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS IN INTERPOSER
- Publication number 20220093536
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INDUCTOR HAVING THERMAL SOLUTION STRUCTURES
- Publication number 20200020652
- Publication date Jan 16, 2020
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES
- Publication number 20200015348
- Publication date Jan 9, 2020
- Intel Corporation
- Michael J. Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC SOLDER MASK ON PACKAGE SUBSTRATE ABOVE MAGNETIC INDUCTOR A...
- Publication number 20200013533
- Publication date Jan 9, 2020
- Intel Corporation
- Malavarayan SANKARASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS
- Publication number 20200005983
- Publication date Jan 2, 2020
- Intel Corporation
- Malavarayan SANKARASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded array capacitor with top and bottom exterior surface metal...
- Publication number 20080128854
- Publication date Jun 5, 2008
- Anne E. Augustine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded array capacitor with side terminals
- Publication number 20080079147
- Publication date Apr 3, 2008
- Michael J. Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Anne E. Augustine

Person

Patents Grantslast 30 patents

Package substrate inductor having thermal interconnect structures

Package substrate inductor having thermal interconnect structures

Package inductor having thermal solution structures

Patents Applicationslast 30 patents

MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...

CAPACITOR IN A SUBSTRATE VIA

CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES

MAGNETIC CORE INDUCTORS IN INTERPOSER

PACKAGE INDUCTOR HAVING THERMAL SOLUTION STRUCTURES

PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES

MAGNETIC SOLDER MASK ON PACKAGE SUBSTRATE ABOVE MAGNETIC INDUCTOR A...

MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS

Embedded array capacitor with top and bottom exterior surface metal...

Embedded array capacitor with side terminals