Anne E. Sanderfer

Person

Campbell, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for ultra thin resist linewidth reduction using implantation
- Patent number 6,642,152
- Issue date Nov 4, 2003
- Advanced Micro Devices, Inc.
- Che-Hoo Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BC13/AR chemistry for metal overetching on a high density plasma et...
- Patent number 6,387,820
- Issue date May 14, 2002
- Advanced Micro Devices, Inc.
- Anne Sanderfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing stress corrosion induced voiding of patterned me...
- Patent number 6,333,263
- Issue date Dec 25, 2001
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to rework device with faulty metal stack layer
- Patent number 6,297,065
- Issue date Oct 2, 2001
- Advanced Micro Devices, Inc.
- Jiahua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing metal corrosion during post metal solvent clean
- Patent number 6,274,504
- Issue date Aug 14, 2001
- Advanced Micro Devices, Inc.
- Anne E. Sanderfer
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Plasma treatment to reduce stress corrosion induced voiding of patt...
- Patent number 6,251,776
- Issue date Jun 26, 2001
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature photoresist removal for rework during metal mask fo...
- Patent number 6,174,819
- Issue date Jan 16, 2001
- Advanced Micro Devices, Inc.
- Jeffrey Allan Shields
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insitu hardmask and metal etch in a single etcher
- Patent number 6,159,863
- Issue date Dec 12, 2000
- Advanced Micro Devices, Inc.
- Susan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to minimize particulate induced clamping failures
- Patent number 6,066,546
- Issue date May 23, 2000
- Advanced Micro Devices, Inc.
- Jeffrey A. Shields
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON OXYNITRIDE ARC FOR METAL PATTERNING
- Publication number 20010045646
- Publication date Nov 29, 2001
- JEFFREY A. SHIELDS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Minimizing metal corrosion during post metal solvent clean
- Publication number 20010027017
- Publication date Oct 4, 2001
- Anne E. Sanderfer
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Method of reducing stress corrosion induced voiding of patterned me...
- Publication number 20010007791
- Publication date Jul 12, 2001
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIMIZING METAL CORROSION DURING POST METAL SOLVENT CLEAN
- Publication number 20010001736
- Publication date May 24, 2001
- ANNE E. SANDERFER
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Anne E. Sanderfer

Person

Patents Grantslast 30 patents

Method for ultra thin resist linewidth reduction using implantation

BC13/AR chemistry for metal overetching on a high density plasma et...

Method of reducing stress corrosion induced voiding of patterned me...

Method to rework device with faulty metal stack layer

Minimizing metal corrosion during post metal solvent clean

Plasma treatment to reduce stress corrosion induced voiding of patt...

Low temperature photoresist removal for rework during metal mask fo...

Insitu hardmask and metal etch in a single etcher

Method to minimize particulate induced clamping failures

Patents Applicationslast 30 patents

SILICON OXYNITRIDE ARC FOR METAL PATTERNING

Minimizing metal corrosion during post metal solvent clean

Method of reducing stress corrosion induced voiding of patterned me...

MINIMIZING METAL CORROSION DURING POST METAL SOLVENT CLEAN