Anne M. Mason

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 11,971,760
- Issue date Apr 30, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Segmented via for vertical PCB interconnect
- Patent number 10,420,213
- Issue date Sep 17, 2019
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for observing an entire communication bus in operation
- Patent number 9,812,401
- Issue date Nov 7, 2017
- Apple Inc.
- Anne M. Mason
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for observing an entire communication bus in operation
- Patent number 9,763,329
- Issue date Sep 12, 2017
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with embedded strain gauges
- Patent number 9,593,991
- Issue date Mar 14, 2017
- Apple Inc.
- Anne M. Mason
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20240306297
- Publication date Sep 12, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20240012458
- Publication date Jan 11, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20220326746
- Publication date Oct 13, 2022
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20220095455
- Publication date Mar 24, 2022
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEGMENTED VIA FOR VERTICAL PCB INTERCONNECT
- Publication number 20190075653
- Publication date Mar 7, 2019
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION
- Publication number 20170263561
- Publication date Sep 14, 2017
- Apple Inc.
- Anne M. Mason
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION
- Publication number 20170265304
- Publication date Sep 14, 2017
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuits With Embedded Strain Gauges
- Publication number 20170030784
- Publication date Feb 2, 2017
- Apple Inc.
- Anne M. Mason
- G01 - MEASURING TESTING

Anne M. Mason

Person

Patents Grantslast 30 patents

Printed circuits with embedded resistive thermal devices

Printed circuits with embedded resistive thermal devices

Three-dimensional (3D) copper in printed circuit boards

Segmented via for vertical PCB interconnect

Techniques for observing an entire communication bus in operation

Techniques for observing an entire communication bus in operation

Printed circuits with embedded strain gauges

Patents Applicationslast 30 patents

Three-Dimensional (3D) Copper in Printed Circuit Boards

Printed Circuits with Embedded Resistive Thermal Devices

Printed Circuits with Embedded Resistive Thermal Devices

Three-Dimensional (3D) Copper in Printed Circuit Boards

SEGMENTED VIA FOR VERTICAL PCB INTERCONNECT

TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION

TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION

Printed Circuits With Embedded Strain Gauges