Annie TAY

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component embedded by laminate sheet
- Patent number 11,116,083
- Issue date Sep 7, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carriers sandwiching a sacrificial structure and having p...
- Patent number 11,051,410
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally highly conductive coating on base structure accommodating...
- Patent number 11,051,391
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sacrificial structure with dummy core and two sections of separate...
- Patent number 10,973,133
- Issue date Apr 6, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component embedding in thinner core using dielectric sheet
- Patent number 10,779,415
- Issue date Sep 15, 2020
- AT&S (China) Co. Ltd.
- Annie Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for copper filling of a hole in a component carrier
- Patent number 10,455,704
- Issue date Oct 22, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ares Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and Plater Arrangement for Failure-Free Copper Filling of a...
- Publication number 20200006135
- Publication date Jan 2, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ares Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Embedded by Laminate Sheet
- Publication number 20190254169
- Publication date Aug 15, 2019
- AT&S (China) Co. Ltd.
- Annie TAY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Embedding in Thinner Core Using Dielectric Sheet
- Publication number 20190116671
- Publication date Apr 18, 2019
- AT&S (China) Co. Ltd.
- Annie TAY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Plater Arrangement for Failure-Free Copper Filling of a...
- Publication number 20190037703
- Publication date Jan 31, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ares Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sacrificial Structure With Dummy Core and Two Sections of Separate...
- Publication number 20180255649
- Publication date Sep 6, 2018
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carriers Sandwiching a Sacrificial Structure and Having P...
- Publication number 20180255650
- Publication date Sep 6, 2018
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally Highly Conductive Coating on Base Structure Accommodating...
- Publication number 20180213634
- Publication date Jul 26, 2018
- Mikael TUOMINEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Electronic component embedded by laminate sheet

Component carriers sandwiching a sacrificial structure and having p...

Thermally highly conductive coating on base structure accommodating...

Sacrificial structure with dummy core and two sections of separate...

Component embedding in thinner core using dielectric sheet

Method for copper filling of a hole in a component carrier

Patents Applicationslast 30 patents

Method and Plater Arrangement for Failure-Free Copper Filling of a...

Electronic Component Embedded by Laminate Sheet

Component Embedding in Thinner Core Using Dielectric Sheet

Method and Plater Arrangement for Failure-Free Copper Filling of a...

Sacrificial Structure With Dummy Core and Two Sections of Separate...

Component Carriers Sandwiching a Sacrificial Structure and Having P...

Thermally Highly Conductive Coating on Base Structure Accommodating...