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Anping Hu
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Shenzhen, CN
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Patents Grants
last 30 patents
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Patent Grant
Sputtering electrode with multiple metallic-layer structure for sem...
Patent number
11,605,721
Issue date
Mar 14, 2023
Kaixuan Shi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of cluster management of network devices and apparatus thereof
Patent number
7,904,535
Issue date
Mar 8, 2011
Huawei Technologies Co., Ltd.
Jiewen Luo
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
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Patent Application
SPUTTERING ELECTRODE WITH MULTIPLE METALLIC-LAYER STRUCTURE FOR SEM...
Publication number
20220069099
Publication date
Mar 3, 2022
Kaixuan Shi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method and system for cluster managing of network facilities
Publication number
20060041650
Publication date
Feb 23, 2006
Huawel Technologies Co., Ltd.
Jiewen Luo
H04 - ELECTRIC COMMUNICATION TECHNIQUE