Anthony A. Vacca

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Eau Claire, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
High density interconnect apparatus
- Patent number 5,211,565
- Issue date May 18, 1993
- Cray Research, Inc.
- Nicholas J. Krajewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect apparatus
- Patent number 5,167,511
- Issue date Dec 1, 1992
- Cray Research, Inc.
- Nicholas J. Krajewski
- H01 - BASIC ELECTRIC ELEMENTS