Anthony J. Farino

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Albuquerque, NM, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level packaging with compression-controlled seal ring bonding
- Patent number 8,575,748
- Issue date Nov 5, 2013
- Sandia Corporation
- Anthony J. Farino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reconditioning of semiconductor substrates to remove photoresist du...
- Patent number 6,682,607
- Issue date Jan 27, 2004
- Sandia Corporation
- Anthony J. Farino
- B08 - CLEANING
Information Patent Grant
Method for photolithographic definition of recessed features on a s...
- Patent number 5,783,340
- Issue date Jul 21, 1998
- Sandia Corporation
- Anthony J. Farino
- B81 - MICRO-STRUCTURAL TECHNOLOGY