Anthony J. Konecni

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective aluminum plug formation and etchback process
- Patent number 6,660,650
- Issue date Dec 9, 2003
- Texas Instruments Incorporated
- Anthony J. Konecni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure, low temperature, semiconductor gap filling process
- Patent number 6,589,865
- Issue date Jul 8, 2003
- Texas Instruments Incorporated
- Girish A. Dixit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a tungsten plug
- Patent number 6,455,419
- Issue date Sep 24, 2002
- Texas Instruments Incorporated
- Anthony J. Konecni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structure, and associated method, to improve crystall...
- Patent number 6,355,558
- Issue date Mar 12, 2002
- Texas Instruments Incorporated
- Girish Dixit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure, low temperature, semiconductor gap filling process
- Patent number 6,333,265
- Issue date Dec 25, 2001
- Texas Instruments Incorporated
- Girish A. Dixit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for constructing semiconductor devices
- Patent number 6,291,347
- Issue date Sep 18, 2001
- Texas Instruments Incorporated
- Noel M. Russell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method of forming a tungstein plug
- Patent number 6,215,186
- Issue date Apr 10, 2001
- Texas Instruments Incorporated
- Anthony J. Konecni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD tin barrier layer for reduced electromigration of aluminum plugs
- Patent number 6,069,072
- Issue date May 30, 2000
- Texas Instruments Incorporated
- Anthony J. Konecni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
PVD deposition process for CVD aluminum liner processing
- Patent number 5,981,382
- Issue date Nov 9, 1999
- Texas Instruments Incorporated
- Anthony J. Konecni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for reducing circuit damage during PECVD in single wafer PE...
- Patent number 5,926,689
- Issue date Jul 20, 1999
- International Business Machines Corporation
- Donna Rizzone Cote
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Elemental titanium-free liner and fabrication process for inter-met...
- Patent number 5,849,367
- Issue date Dec 15, 1998
- Texas Instruments Incorporated
- Girish A. Dixit
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method and system for selectively coupling a conductive material to...
- Publication number 20030168736
- Publication date Sep 11, 2003
- Anthony J. Konecni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low pressure, low temperature, semiconductor gap filling process
- Publication number 20020064942
- Publication date May 30, 2002
- Girish A. Dixit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a self-aligned copper capping diffusion barrier
- Publication number 20020048926
- Publication date Apr 25, 2002
- Anthony J. Konecni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for selectively coupling a conductive material to...
- Publication number 20010049192
- Publication date Dec 6, 2001
- Anthony J. Konecni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Anthony J. Konecni

Person

Patents Grantslast 30 patents

Selective aluminum plug formation and etchback process

Low pressure, low temperature, semiconductor gap filling process

System and method of forming a tungsten plug

Metallization structure, and associated method, to improve crystall...

Low pressure, low temperature, semiconductor gap filling process

Method and system for constructing semiconductor devices

System and method of forming a tungstein plug

CVD tin barrier layer for reduced electromigration of aluminum plugs

PVD deposition process for CVD aluminum liner processing

Process for reducing circuit damage during PECVD in single wafer PE...

Elemental titanium-free liner and fabrication process for inter-met...

Patents Applicationslast 30 patents

Method and system for selectively coupling a conductive material to...

Low pressure, low temperature, semiconductor gap filling process

Method for forming a self-aligned copper capping diffusion barrier

Method and system for selectively coupling a conductive material to...