Anthony M. Chiu

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 12,308,326
- Issue date May 20, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture utilizing wafer to wafer bonding
- Patent number 12,087,656
- Issue date Sep 10, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 11,948,893
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die stacked with backer die including capacitors...
- Patent number 11,699,629
- Issue date Jul 11, 2023
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture utilizing wafer to wafer bonding
- Patent number 11,637,050
- Issue date Apr 25, 2023
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for advanced antenna systems
- Patent number 11,303,009
- Issue date Apr 12, 2022
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity package
- Patent number 10,177,064
- Issue date Jan 8, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a multi-channel modulator driver with enclosure
- Patent number 9,936,587
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Craig Steinbeiser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Top-side cooling of RF products in air cavity composite packages
- Patent number 9,899,292
- Issue date Feb 20, 2018
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enclosure for a multi-channel modulator driver
- Patent number 9,113,549
- Issue date Aug 18, 2015
- TriQuint Semiconductor, Inc.
- Craig Steinbeiser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for improving solder joint reliability in an inte...
- Patent number 8,524,531
- Issue date Sep 3, 2013
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuel cell device
- Patent number 8,367,271
- Issue date Feb 5, 2013
- STMicroelectronics, Inc.
- Anthony M. Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
System and method for improving solder joint reliability in an inte...
- Patent number 8,330,258
- Issue date Dec 11, 2012
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuel cell device
- Patent number 8,202,668
- Issue date Jun 19, 2012
- STMicroelectronics, Inc.
- Anthony M. Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Fuel cell device
- Patent number 8,202,667
- Issue date Jun 19, 2012
- STMicroelectronics, Inc.
- Anthony M. Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Fuel cell device
- Patent number 8,178,250
- Issue date May 15, 2012
- STMicroelectronics, Inc.
- Anthony M. Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for providing a redistribution metal layer in an integrated...
- Patent number 8,163,645
- Issue date Apr 24, 2012
- STMicroelectronics, Inc.
- Danielle A. Thomas
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System for providing a redistribution metal layer in an integrated...
- Patent number 7,786,582
- Issue date Aug 31, 2010
- STMicroelectronics, Inc.
- Danielle A. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using a pre-formed film in a transfer molding process fo...
- Patent number 7,595,017
- Issue date Sep 29, 2009
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuel cell device
- Patent number 7,547,483
- Issue date Jun 16, 2009
- STMicroelectronics, Inc.
- Anthony M. Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
System and method for venting pressure from an integrated circuit p...
- Patent number 7,534,716
- Issue date May 19, 2009
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for increasing the strength of a bond made by a s...
- Patent number 7,482,260
- Issue date Jan 27, 2009
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive devices
- Patent number 7,382,056
- Issue date Jun 3, 2008
- Sychip Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making optical elements for an optical disc system
- Patent number 7,323,114
- Issue date Jan 29, 2008
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method for increasing the strength of a bond made by a s...
- Patent number 7,265,452
- Issue date Sep 4, 2007
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded flat film molding
- Patent number 7,202,110
- Issue date Apr 10, 2007
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper interposer for reducing warping of integrated circuit packag...
- Patent number 7,196,425
- Issue date Mar 27, 2007
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for venting pressure from an integrated circuit p...
- Patent number 7,126,210
- Issue date Oct 24, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with exposed die surfaces and auxiliary...
- Patent number 7,109,574
- Issue date Sep 19, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated lid formed on MEMS device
- Patent number 7,098,065
- Issue date Aug 29, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20250201728
- Publication date Jun 19, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP SIDE COOLING FOR POWER AMPLIFIER MODULE
- Publication number 20250022765
- Publication date Jan 16, 2025
- Qorvo US, Inc.
- Miles Larkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20240379487
- Publication date Nov 14, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20240250041
- Publication date Jul 25, 2024
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20230298958
- Publication date Sep 21, 2023
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20230197629
- Publication date Jun 22, 2023
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20220319945
- Publication date Oct 6, 2022
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE STACKED WITH BACKER DIE INCLUDING CAPACITORS...
- Publication number 20220310471
- Publication date Sep 29, 2022
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FOR ADVANCED ANTENNA SYSTEMS
- Publication number 20210050650
- Publication date Feb 18, 2021
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CAVITY PACKAGE
- Publication number 20180061730
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-SIDE COOLING OF RF PRODUCTS IN AIR CAVITY COMPOSITE PACKAGES
- Publication number 20170229368
- Publication date Aug 10, 2017
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER
- Publication number 20150334848
- Publication date Nov 19, 2015
- TriQuint Semiconductor, Inc.
- Craig Steinbeiser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER
- Publication number 20130141883
- Publication date Jun 6, 2013
- TriQuint Semiconductor, Inc.
- Craig Steinbeiser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTE...
- Publication number 20130130492
- Publication date May 23, 2013
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for providing a redistribution metal layer in an integrated...
- Publication number 20100297841
- Publication date Nov 25, 2010
- Danielle A. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUEL CELL DEVICE
- Publication number 20090208792
- Publication date Aug 20, 2009
- STMicroelectronics, Inc.
- Anthony M. CHIU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FUEL CELL DEVICE
- Publication number 20090208791
- Publication date Aug 20, 2009
- STMicroelectronics, Inc.
- Anthony M. CHIU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FUEL CELL DEVICE
- Publication number 20090208794
- Publication date Aug 20, 2009
- STMicroelectronics, Inc.
- Anthony M. CHIU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FUEL CELL DEVICE
- Publication number 20090208802
- Publication date Aug 20, 2009
- STMicroelectronics, Inc.
- Anthony M. CHIU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and method for increasing the strength of a bond made by a s...
- Publication number 20080064208
- Publication date Mar 13, 2008
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for venting pressure from an integrated circuit p...
- Publication number 20070001286
- Publication date Jan 4, 2007
- STMicroelectronics, Inc.
- Anthony M. Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Leadframeless package structure and method
- Publication number 20060261450
- Publication date Nov 23, 2006
- STMicroelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for providing a redistribution metal layer in an integrated...
- Publication number 20060234423
- Publication date Oct 19, 2006
- STMicroelectronics, Inc.
- Danielle A. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making optical elements for an optical disc system
- Publication number 20060144813
- Publication date Jul 6, 2006
- Anthony M. Chiu
- G02 - OPTICS
Information Patent Application
Copper interposer for reducing warping of integrated circuit packag...
- Publication number 20060071345
- Publication date Apr 6, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fuel cell device
- Publication number 20060073368
- Publication date Apr 6, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTEGRATED LID FORMED ON MEMS DEVICE
- Publication number 20060065961
- Publication date Mar 30, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated passive devices
- Publication number 20050253257
- Publication date Nov 17, 2005
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded flat film molding
- Publication number 20050161784
- Publication date Jul 28, 2005
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for increasing the strength of a bond made by a s...
- Publication number 20050150933
- Publication date Jul 14, 2005
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Anthony M. Chiu

Person

Patents Grantslast 30 patents

Electronic component with lid to manage radiation feedback

Package architecture utilizing wafer to wafer bonding

Electronic component with lid to manage radiation feedback

Integrated circuit die stacked with backer die including capacitors...

Package architecture utilizing wafer to wafer bonding

Packages for advanced antenna systems

Air cavity package

Method of fabricating a multi-channel modulator driver with enclosure

Top-side cooling of RF products in air cavity composite packages

Enclosure for a multi-channel modulator driver

System and method for improving solder joint reliability in an inte...

Fuel cell device

System and method for improving solder joint reliability in an inte...

Fuel cell device

Fuel cell device

Fuel cell device

Method for providing a redistribution metal layer in an integrated...

System for providing a redistribution metal layer in an integrated...

Method for using a pre-formed film in a transfer molding process fo...

Fuel cell device

System and method for venting pressure from an integrated circuit p...

System and method for increasing the strength of a bond made by a s...

Integrated passive devices

Method of making optical elements for an optical disc system

System and method for increasing the strength of a bond made by a s...

Embedded flat film molding

Copper interposer for reducing warping of integrated circuit packag...

System and method for venting pressure from an integrated circuit p...

Integrated circuit package with exposed die surfaces and auxiliary...

Integrated lid formed on MEMS device

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

TOP SIDE COOLING FOR POWER AMPLIFIER MODULE

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

INTEGRATED CIRCUIT DIE STACKED WITH BACKER DIE INCLUDING CAPACITORS...

PACKAGES FOR ADVANCED ANTENNA SYSTEMS

AIR CAVITY PACKAGE

TOP-SIDE COOLING OF RF PRODUCTS IN AIR CAVITY COMPOSITE PACKAGES

ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER

ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER

SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTE...

Method for providing a redistribution metal layer in an integrated...

FUEL CELL DEVICE

FUEL CELL DEVICE

FUEL CELL DEVICE

FUEL CELL DEVICE

System and method for increasing the strength of a bond made by a s...

System and method for venting pressure from an integrated circuit p...

Leadframeless package structure and method

System for providing a redistribution metal layer in an integrated...

Method of making optical elements for an optical disc system

Copper interposer for reducing warping of integrated circuit packag...

Fuel cell device

INTEGRATED LID FORMED ON MEMS DEVICE

Integrated passive devices

Embedded flat film molding

System and method for increasing the strength of a bond made by a s...