Anthony M. Pavio

Person

Paradise Valley, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Localized enhancement of multilayer substrate thickness for high Q...
- Patent number 7,221,244
- Issue date May 22, 2007
- Motorola, Inc.
- John C. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized enhancement of multilayer substrate thickness for high Q...
- Patent number 6,971,162
- Issue date Dec 6, 2005
- Motorola, Inc.
- John C. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bidirectional distributed amplifier
- Patent number 6,961,553
- Issue date Nov 1, 2005
- Motorola, Inc.
- Lei Zhao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer balun with high process tolerance
- Patent number 6,873,221
- Issue date Mar 29, 2005
- Motorola, Inc.
- Rodolfo Lucero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadband balun and impedance transformer for push-pull amplifiers
- Patent number 6,819,200
- Issue date Nov 16, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Lei Zhao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multilayer ceramic package transmission line probe
- Patent number 6,803,836
- Issue date Oct 12, 2004
- FREESCALE SEMICONDUCTOR, INC.
- John C. Estes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapered constant “R” network for use in distributed...
- Patent number 6,714,095
- Issue date Mar 30, 2004
- Motorola, Inc.
- Anthony M. Pavio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broad band impedance matching device with coupled transmission lines
- Patent number 6,664,935
- Issue date Dec 16, 2003
- Motorola, Inc.
- William John Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broad band impedance matching device with reduced line width
- Patent number 6,653,911
- Issue date Nov 25, 2003
- Motorola, Inc.
- John C. Estes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropump including ball check valve utilizing ceramic technology a...
- Patent number 6,620,273
- Issue date Sep 16, 2003
- Motorola, Inc.
- Xunhu Dai
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Hybrid structure for distributed power amplifiers
- Patent number 6,614,307
- Issue date Sep 2, 2003
- Motorola, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropump including ball check valve utilizing ceramic technology a...
- Patent number 6,554,591
- Issue date Apr 29, 2003
- Motorola, Inc.
- Xunhu Dai
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Switch assembly and method of forming the same
- Patent number 6,459,344
- Issue date Oct 1, 2002
- Motorola, Inc.
- Anthony M. Pavio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for amplifying a telecommunication signal
- Patent number 6,433,640
- Issue date Aug 13, 2002
- Motorola, Inc.
- Anthony M. Pavio
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Distributed amplifier having separately biased sections
- Patent number 6,377,125
- Issue date Apr 23, 2002
- Motorola Inc.
- Anthony M. Pavio
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High frequency semiconductor component
- Patent number 5,773,887
- Issue date Jun 30, 1998
- Motorola, Inc.
- Anthony M. Pavio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonator with metal layers devoid of DC connection and semiconduct...
- Patent number 5,751,201
- Issue date May 12, 1998
- Motorola, Inc.
- Anthony M. Pavio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Localized enhancement of multilayer substrate thickness for high Q...
- Publication number 20060027385
- Publication date Feb 9, 2006
- John C. Estes
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Localized enhancement of multilayer substrate thickness for high Q...
- Publication number 20040228099
- Publication date Nov 18, 2004
- John C. Estes
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Multilayer balun with high process tolerance
- Publication number 20040217824
- Publication date Nov 4, 2004
- Rodolfo Lucero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bidirectional distributed amplifier
- Publication number 20040202311
- Publication date Oct 14, 2004
- Lei Zhao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multilayer ceramic package transmission line probe
- Publication number 20040061576
- Publication date Apr 1, 2004
- John C. Estes
- B32 - LAYERED PRODUCTS
Information Patent Application
Broadband balun and impedance transformer for push-pull amplifiers
- Publication number 20040017266
- Publication date Jan 29, 2004
- Lei Zhao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Tapered constant "R" network for use in distributed amplifiers
- Publication number 20030231079
- Publication date Dec 18, 2003
- Anthony M. Pavio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Broad band impedance matching device with reduced line width
- Publication number 20030193376
- Publication date Oct 16, 2003
- John C. Estes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micropump including ball check valve utilizing ceramic technology a...
- Publication number 20030123993
- Publication date Jul 3, 2003
- Xunhu Dai
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Distributed amplifier with transistors in a cascode configuration a...
- Publication number 20020130720
- Publication date Sep 19, 2002
- MOTOROLA, INC.
- Anthony M. Pavio
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Switch assembly and method of forming the same
- Publication number 20020130732
- Publication date Sep 19, 2002
- MOTOROLA, INC.
- Anthony M. Pavio
- H01 - BASIC ELECTRIC ELEMENTS

Anthony M. Pavio

Person

Patents Grantslast 30 patents

Localized enhancement of multilayer substrate thickness for high Q...

Localized enhancement of multilayer substrate thickness for high Q...

Bidirectional distributed amplifier

Multilayer balun with high process tolerance

Broadband balun and impedance transformer for push-pull amplifiers

Multilayer ceramic package transmission line probe

Tapered constant &#x0201C;R&#x0201D; network for use in distributed...

Broad band impedance matching device with coupled transmission lines

Broad band impedance matching device with reduced line width

Micropump including ball check valve utilizing ceramic technology a...

Hybrid structure for distributed power amplifiers

Micropump including ball check valve utilizing ceramic technology a...

Switch assembly and method of forming the same

Methods and apparatus for amplifying a telecommunication signal

Distributed amplifier having separately biased sections

High frequency semiconductor component

Resonator with metal layers devoid of DC connection and semiconduct...

Patents Applicationslast 30 patents

Localized enhancement of multilayer substrate thickness for high Q...

Localized enhancement of multilayer substrate thickness for high Q...

Multilayer balun with high process tolerance

Bidirectional distributed amplifier

Multilayer ceramic package transmission line probe

Broadband balun and impedance transformer for push-pull amplifiers

Tapered constant "R" network for use in distributed amplifiers

Broad band impedance matching device with reduced line width

Micropump including ball check valve utilizing ceramic technology a...

Distributed amplifier with transistors in a cascode configuration a...

Switch assembly and method of forming the same

Tapered constant “R” network for use in distributed...