Anthony MCNELLY

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Berlin, DE

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Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS
- Publication number 20160060781
- Publication date Mar 3, 2016
- Atotech Deutschland GmbH
- Markus GLOEDEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR