Anthony SCHEPIS

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of patterning a substrate using a sidewall spacer etch mask
- Patent number 12,099,299
- Issue date Sep 24, 2024
- Tokyo Electron Limited
- Jodi Grzeskowiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision multi-axis photolithography alignment correction using st...
- Patent number 12,001,147
- Issue date Jun 4, 2024
- Tokyo Electron Limited
- Daniel J. Fulford
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for die-level unique authentication and serialization of sem...
- Patent number 11,862,497
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic self-limiting etch process
- Patent number 11,791,167
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Anthony R. Schepis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a substrate using a sidewall spacer etch mask
- Patent number 11,782,346
- Issue date Oct 10, 2023
- Tokyo Electron Limited
- Jodi Grzeskowiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of spin-on films
- Patent number 11,776,808
- Issue date Oct 3, 2023
- Tokyo Electron Limited
- Anthony R. Schepis
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Localized stress regions for three-dimension chiplet formation
- Patent number 11,721,551
- Issue date Aug 8, 2023
- Tokyo Electron Limited
- Anton J. Devilliers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized stress regions for three-dimension chiplet formation
- Patent number 11,688,642
- Issue date Jun 27, 2023
- Tokyo Electron Limited
- Anton J. Devilliers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial see-through alignment imaging system
- Patent number 11,526,088
- Issue date Dec 13, 2022
- Tokyo Electron Limited
- Anton J. Devilliers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for die-level unique authentication and serialization of sem...
- Patent number 11,133,206
- Issue date Sep 28, 2021
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PATTERNING A SUBSTRATE USING A SIDEWALL SPACER ETCH MASK
- Publication number 20230367217
- Publication date Nov 16, 2023
- TOKYO ELECTRON LIMITED
- Jodi GRZESKOWIAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PATTERNING-BONDING SEMICONDUCTOR TOOL
- Publication number 20230326814
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHUCK COMPENSATION VIA WAFER SHAPE CONTROL
- Publication number 20230326738
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SHAPE CONTROL FOR W2W BONDING
- Publication number 20230326767
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...
- Publication number 20230251584
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Daniel J. FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ENHANCE LITHOGRAPHY PATTERN CREATION USING SEMICONDUCTOR...
- Publication number 20230251574
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- G01 - MEASURING TESTING
Information Patent Application
PRECISION MULTI-AXIS PHOTOLITHOGRAPHY ALIGNMENT CORRECTION USING ST...
- Publication number 20230161267
- Publication date May 25, 2023
- TOKYO ELECTRON LIMITED
- Daniel J. FULFORD
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...
- Publication number 20230008350
- Publication date Jan 12, 2023
- TOKYO ELECTRON LIMITED
- Charlotte CUTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED STRESS REGIONS FOR THREE-DIMENSION CHIPLET FORMATION
- Publication number 20220238380
- Publication date Jul 28, 2022
- TOKYO ELECTRON LIMITED
- Anton J. DEVILLIERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED STRESS REGIONS FOR THREE-DIMENSION CHIPLET FORMATION
- Publication number 20220238328
- Publication date Jul 28, 2022
- TOKYO ELECTRON LIMITED
- Anton J. DEVILLIERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Destructive Coupon Generation via Direct Write Lithography for...
- Publication number 20220113635
- Publication date Apr 14, 2022
- TOKYO ELECTRON LIMITED
- Anthony R. Schepis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL SEE-THROUGH INSPECTION SYSTEM
- Publication number 20220050386
- Publication date Feb 17, 2022
- TOKYO ELECTRON LIMITED
- Anton J. DEVILLIERS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COAXIAL SEE-THROUGH ALIGNMENT IMAGING SYSTEM
- Publication number 20220050388
- Publication date Feb 17, 2022
- TOKYO ELECTRON LIMITED
- Anton J. DEVILLIERS
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEM...
- Publication number 20210351053
- Publication date Nov 11, 2021
- TOKYO ELECTRON LIMITED
- H. Jim FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cyclic Self-Limiting Etch Process
- Publication number 20210305060
- Publication date Sep 30, 2021
- TOKYO ELECTRON LIMITED
- Anthony R. Schepis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarization of Spin-On Films
- Publication number 20210296121
- Publication date Sep 23, 2021
- TOKYO ELECTRON LIMITED
- Anthony R. Schepis
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PATTERNING A SUBSTRATE
- Publication number 20210088907
- Publication date Mar 25, 2021
- TOKYO ELECTRON LIMITED
- Jodi GRZESKOWIAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEM...
- Publication number 20200328103
- Publication date Oct 15, 2020
- TOKYO ELECTRON LIMITED
- H. Jim FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEM...
- Publication number 20200328102
- Publication date Oct 15, 2020
- TOKYO ELECTRON LIMITED
- Anthony SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS

Anthony SCHEPIS

Person

Patents Grantslast 30 patents

Method of patterning a substrate using a sidewall spacer etch mask

Precision multi-axis photolithography alignment correction using st...

Method for die-level unique authentication and serialization of sem...

Cyclic self-limiting etch process

Method of patterning a substrate using a sidewall spacer etch mask

Planarization of spin-on films

Localized stress regions for three-dimension chiplet formation

Localized stress regions for three-dimension chiplet formation

Coaxial see-through alignment imaging system

Method for die-level unique authentication and serialization of sem...

Patents Applicationslast 30 patents

METHOD OF PATTERNING A SUBSTRATE USING A SIDEWALL SPACER ETCH MASK

HYBRID PATTERNING-BONDING SEMICONDUCTOR TOOL

METHOD FOR CHUCK COMPENSATION VIA WAFER SHAPE CONTROL

WAFER SHAPE CONTROL FOR W2W BONDING

IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...

METHOD TO ENHANCE LITHOGRAPHY PATTERN CREATION USING SEMICONDUCTOR...

PRECISION MULTI-AXIS PHOTOLITHOGRAPHY ALIGNMENT CORRECTION USING ST...

METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...

LOCALIZED STRESS REGIONS FOR THREE-DIMENSION CHIPLET FORMATION

LOCALIZED STRESS REGIONS FOR THREE-DIMENSION CHIPLET FORMATION

Non-Destructive Coupon Generation via Direct Write Lithography for...

COAXIAL SEE-THROUGH INSPECTION SYSTEM

COAXIAL SEE-THROUGH ALIGNMENT IMAGING SYSTEM

METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEM...

Cyclic Self-Limiting Etch Process

Planarization of Spin-On Films

PATTERNING A SUBSTRATE

METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEM...

METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEM...