Anthony Yi Sheng Sun

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,842,792
- Issue date Dec 12, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Danny Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,281,218
- Issue date Mar 8, 2016
- United Test & Assembly Center Ltd.
- Danny Retuta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR PACKAGE
- Publication number 20160211196
- Publication date Jul 21, 2016
- United Test & Assembly Center Ltd.
- Danny RETUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing a Semiconductor Package
- Publication number 20080061414
- Publication date Mar 13, 2008
- United Test & Assembly Center Ltd.
- Danny RETUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Packages
- Publication number 20080054435
- Publication date Mar 6, 2008
- United Test and Assembly Center, Ltd.
- Gaurav MEHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe enhancement and method of producing a multi-row semicondu...
- Publication number 20070246810
- Publication date Oct 25, 2007
- UNITED TEST AND ASSEMBLY TEST CENTER LTD.
- Danny Vallejo Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance chip scale leadframe with t-shape die pad and meth...
- Publication number 20060202313
- Publication date Sep 14, 2006
- UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density chip scale leadframe package and method of manufacturi...
- Publication number 20040104457
- Publication date Jun 3, 2004
- UNITED TEST AND ASSEMBLY TEST CENTER LTD.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS