Anton Huber

Person

Burghausen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Wire guide roll for wire saw and method
- Patent number 10,245,661
- Issue date Apr 2, 2019
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing wafers from a workpiece
- Patent number 9,073,135
- Issue date Jul 7, 2015
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cooling a workpiece made of semiconductor material durin...
- Patent number 8,968,054
- Issue date Mar 3, 2015
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing wafers from a workpiece
- Patent number 8,746,227
- Issue date Jun 10, 2014
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for simultaneously slicing at least two cylindrical workpiec...
- Patent number 7,766,724
- Issue date Aug 3, 2010
- Siltronic AG
- Anton Huber
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor wafers with highly precise edge profile and method fo...
- Patent number 7,767,470
- Issue date Aug 3, 2010
- Siltronic AG
- Peter Wagner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a semiconductor wafer with profiled edge
- Patent number 7,704,126
- Issue date Apr 27, 2010
- Siltronic AG
- Joachim Mattes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing material from a semiconductor wafer
- Patent number 7,108,583
- Issue date Sep 19, 2006
- Siltronic AG
- Alexander Heilmaier
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer with improved local flatness, and method for it...
- Patent number 7,077,726
- Issue date Jul 18, 2006
- Siltronic AG
- Georg J. Pietsch
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Double-sided polishing process for producing a multiplicity of sili...
- Patent number 6,861,360
- Issue date Mar 1, 2005
- Siltronic AG
- Guido Wenski
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for cutting a multiplicity of disks from a hard b...
- Patent number 6,390,896
- Issue date May 21, 2002
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Anton Huber
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer holder and method of producing a semiconductor wafer
- Patent number 6,117,776
- Issue date Sep 12, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Anton Huber
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece holder for rotary grinding machines for grinding semicond...
- Patent number 5,567,199
- Issue date Oct 22, 1996
- Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing semiconductor wafers having deformation g...
- Patent number 5,400,548
- Issue date Mar 28, 1995
- Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
- Anton Huber
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SLICING WAFERS FROM A WORKPIECE
- Publication number 20120240915
- Publication date Sep 27, 2012
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SLICING WAFERS FROM A WORKPIECE
- Publication number 20120240914
- Publication date Sep 27, 2012
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR COOLING A WORKPIECE MADE OF SEMICONDUCTOR MATERIAL DURIN...
- Publication number 20120178346
- Publication date Jul 12, 2012
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wire Guide Roll For Wire Saw
- Publication number 20080264228
- Publication date Oct 30, 2008
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIEC...
- Publication number 20080099006
- Publication date May 1, 2008
- Siltronic AG
- Anton Huber
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Semiconductor Wafers With Highly Precise Edge Profile And Method Fo...
- Publication number 20080036040
- Publication date Feb 14, 2008
- Siltronic AG
- Peter Wagner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Producing A Semiconductor Wafer With Profiled Edge
- Publication number 20070264911
- Publication date Nov 15, 2007
- Siltronic AG
- Joachim Mattes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING MATERIAL FROM A SEMICONDUCTOR WAFER
- Publication number 20060211338
- Publication date Sep 21, 2006
- Silitronic AG
- Alexander Heilmaier
- B24 - GRINDING POLISHING
Information Patent Application
Silicon semiconductor wafer, and process for producing a multiplici...
- Publication number 20030109139
- Publication date Jun 12, 2003
- Guido Wenski
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer with improved local flatness, and method for it...
- Publication number 20030060050
- Publication date Mar 27, 2003
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Georg J. Pietsch
- H01 - BASIC ELECTRIC ELEMENTS

Anton Huber

Person

Patents Grantslast 30 patents

Wire guide roll for wire saw and method

Method for slicing wafers from a workpiece

Method for cooling a workpiece made of semiconductor material durin...

Method for slicing wafers from a workpiece

Method for simultaneously slicing at least two cylindrical workpiec...

Semiconductor wafers with highly precise edge profile and method fo...

Method for producing a semiconductor wafer with profiled edge

Method for removing material from a semiconductor wafer

Semiconductor wafer with improved local flatness, and method for it...

Double-sided polishing process for producing a multiplicity of sili...

Method and device for cutting a multiplicity of disks from a hard b...

Wafer holder and method of producing a semiconductor wafer

Workpiece holder for rotary grinding machines for grinding semicond...

Process for manufacturing semiconductor wafers having deformation g...

Patents Applicationslast 30 patents

METHOD FOR SLICING WAFERS FROM A WORKPIECE

METHOD FOR SLICING WAFERS FROM A WORKPIECE

METHOD FOR COOLING A WORKPIECE MADE OF SEMICONDUCTOR MATERIAL DURIN...

Wire Guide Roll For Wire Saw

METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIEC...

Semiconductor Wafers With Highly Precise Edge Profile And Method Fo...

Method For Producing A Semiconductor Wafer With Profiled Edge

METHOD FOR REMOVING MATERIAL FROM A SEMICONDUCTOR WAFER

Silicon semiconductor wafer, and process for producing a multiplici...

Semiconductor wafer with improved local flatness, and method for it...